Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2008

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Characterization of Serial Links at 5.5Gbps on FR4 Backplanes, Vittorio Ricchiuti, Antonio Orlandi, James L. Drewniak, and Francesco de Paulis

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Closed-form Expressions for Determining Approximate PMC Boundaries Around an Aperture in a Metal Cavity Wall, Francesco de Paulis, Yaojiang Zhang, Jun Fan, Jason A. Mix, Xiaopeng Dong, Daniel Hua, and Kevin P. Slattery

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Design Methodology for PDN Synthesis on Multilayer PCBs, Bruce Archambeault, Matteo Cocchini, Giuseppe Selli, Jun Fan, James L. Knighten, Samuel R. Connor, Antonio Orlandi, and James L. Drewniak

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Differential Vias Transition Modeling in a Multilayer Printed Circuit Board, Matteo Cocchini, Wheling Cheng, Jianmin Zhang, John Fisher, Jun Fan, James L. Drewniak, and Yaojiang Zhang

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Efficient Prediction of RF Interference in a Shielding Enclosure with PCBs using a General Segmentation Method, Yaojiang Zhang, Xiaopeng Dong, Zhenwei Yu, Francesco de Paulis, Gang Feng, Jason A. Mix, Daniel Hua, Kevin P. Slattery, James L. Drewniak, and Jun Fan

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Eliminating Via-Plane Coupling using Ground Vias for High-Speed Signal Transitions, Songping Wu, Xin Chang, Christian Schuster, Xiaoxiong Gu, and Jun Fan

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Extraction of Causal RLGC Models from Measurements for Signal Link Path Analysis, Jianmin Zhang, Qinghua B. Chen, Zhiqiang Qiu, James L. Drewniak, and Antonio Orlandi

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Link Path Design on a Block-by-Block Basis, Francesco de Paulis, Jun Fan, Jay Diepenbrock, Samuel Connor, Antonio Orlandi, and Bruce Archambeault

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Method of Edge Currents for Calculating Mutual External Inductance in a Microstrip Structure, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David Pommerenke, Matteo Cocchini, and David M. Hockanson

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Modeling Interference Coupling between Two Orthogonal Strip Lines on Adjacent Layers, Kenji Araki, Fengchao Xiao, Yoshio Kami, Hemant Bishnoi, and James L. Drewniak

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Mutual External Inductance in Stripline Structures, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David Pommerenke, Matteo Cocchini, and David M. Hockanson

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Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB, Matteo Cocchini, Jun Fan, Bruce Archambeault, James L. Knighten, Xin Chang, James L. Drewniak, Yaojiang Zhang, and Samuel R. Connor

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Reconstruction of Dispersive Dielectric Properties for PCB Substrates using a Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, David Pommerenke, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, Konstantin Rozanov, Antonio Orlandi, and Giulio Antonini

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Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions, Xin Chang, Bruce Archambeault, Matteo Cocchini, Francesco de Paulis, Vysakh Sivarajan, Yaojiang Zhang, Jun Fan, Samuel R. Connor, Antonio Orlandi, and James L. Drewniak

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Simulation of Via Interconnects using Physics-Based Models and Microwave Network Parameters, Renato Rimolo-Donadio, Andrezj J. Stepan, H. D. Bruns, James L. Drewniak, and Christian Schuster

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Susceptibility Scanning as Failure Analysis Tool for System-Level Electrostatic Discharge (ESD) Problems, Giorgi Muchaidze, Jayong Koo, Qing Cai, Tun Li, Lijun Han, Andrew Martwick, Kai Wang, Jin Min, James L. Drewniak, and David Pommerenke

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The Influence of Test Parameters on TEM Cell Measurements of ICs, Vijay Kasturi and Daryl G. Beetner

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Time Synchronized Near-Field and Far-Field for EMI Source Identification, Gang Feng, Wei Wu, David Pommerenke, Jun Fan, and Daryl G. Beetner

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Using TWDP to Quantify Channel Performance with Frequency-Domain S-Parameter Data, Surbhi Mittal, Zhiping Yang, Jun Fan, and Francesco de Paulis

Submissions from 2007

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A Three-Dimensional FDTD Subgridding Algorithm with Separated Temporal and Spatial Interfaces and Related Stability Analysis, Kai Xiao, David Pommerenke, and James L. Drewniak

Comparing Time-Domain and Frequency Domain Techniques for Investigation on Charge Delivery and Power-Bus Noise for High-Speed Printed Circuit Boards, James L. Drewniak, Bruce Archambeault, James L. Knighten, Giuseppe Selli, Jun Fan, Matteo Cocchini, Samuel R. Connor, and Liang Xue

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Development and Application of a High-Resolution Thin-Film Probe, Shaohua Li, Kuifeng Hu, Daryl G. Beetner, James L. Drewniak, James N. Reck, Matthew O'Keefe, Kai Wang, Xiaopeng Dong, and Kevin P. Slattery

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Early Time Charge Replenishment of the Power Delivery Network in Multi-Layer PCBs, Giuseppe Selli, Matteo Cocchini, James L. Knighten, Bruce Archambeault, Jun Fan, Samuel R. Connor, Antonio Orlandi, and James L. Drewniak

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Engineering of Absorbing Gaskets Between Metal Plates, Marina Koledintseva, Sandeep K. R. Chandra, James L. Drewniak, and James A. Lenn

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Estimation of High-Frequency Currents from Near-Field Scan Measurements, Haixiao Weng, Daryl G. Beetner, Richard E. DuBroff, and Jin Shi

Evaluation of the Shielding Characteristics of a Commercial 19-inch Rack-Based Cabinet, Jue Chen, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, and John Flavin

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Hand-Assembled Cable Bundle Modeling for Crosstalk and Common-Mode Radiation Prediction, Shishuang Sun, Geping Liu, James L. Drewniak, and David Pommerenke

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Modeling Noise Coupling Between Package and PCB Power/Ground Planes with an Efficient 2-D FDTD/Lumped Element Method, Ting-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, James L. Drewniak, and Tzong-Lin Wu

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Mode Suppressed TEM Cell Design for High Frequency IC Measurements, Shaowei Deng, David Pommerenke, Todd H. Hubing, James L. Drewniak, Daryl G. Beetner, Dongshik Shin, Sungnam Kim, and Hocheol Kwak

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Numerical Modeling of Periodic Composite Media for Electromagnetic Shielding Application, Dagang Wu, Rui Qiang, Ji Chen, Ce Liu, Marina Koledintseva, James L. Drewniak, and Bruce Archambeault

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Predictive Modeling of the Effects of Skew and Imbalance on Radiated EMI from Cables, J. Chen, James L. Drewniak, Richard E. DuBroff, James L. Knighten, Jun Fan, and J. Flavin

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SPICE-Compatible Cavity and Transmission Line Model for Power Bus with Narrow Slots, Gang Feng, Yaojiang Zhang, James L. Drewniak, and Lin Zhang

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Validation of Worst-Case and Statistical Models for an Automotive EMC Expert System, Daryl G. Beetner, Haixiao Weng, Meilin Wu, and Todd H. Hubing

Submissions from 2006

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A Method for Charactering EMI Coupling Paths and Source Properties in Complex Systems, Shishuang Sun, Gang Feng, Chong Ding, David Pommerenke, and James L. Drewniak

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Analysis of Noise Coupling Result from Overlapping Power Areas within Power Delivery Networks, Gang Feng, Giuseppe Selli, Kundan Chand, Mauro Lai, Liang Xue, James L. Drewniak, Bruce Archambeault, Samuel R. Connor, and Erdem Matoglu

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An Efficient Approach for Power Delivery Network Design with Closed-Form Expressions for Parasitic Interconnect Inductances, Chen Wang, Jingkun Mao, Giuseppe Selli, Shaofeng Luan, Lin Zhang, Jun Fan, David Pommerenke, Richard E. DuBroff, and James L. Drewniak

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Characterizing Package/PCB PDN Interactions from a Full-Wave Finite-Difference Formulation, Shishuang Sun, David Pommerenke, James L. Drewniak, Kai Xiao, Sin-Ting Chen, and Tzong-Lin Wu

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Common-Mode Radiation Resulting from Hand-Assembled Cable Bundles on Automotive Platforms, Shishuang Sun, James L. Drewniak, and David Pommerenke

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Crosstalk Analysis for Nonparallel Transmission Lines using PEEC with a Dynamic Green's Function Formulation, Michael A. Cracraft and James L. Drewniak

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Engineering of Ferrite-Graphite Composite Media for Microwave Shields, Marina Koledintseva, Poorna Chander Ravva, James L. Drewniak, Alexander A. Kitaytsev, and Andrey A. Shinkov

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Influence of an Extended Stub at Connector Ports on Signal Launches and TRL De-embedding, Jianmin Zhang, James L. Drewniak, David Pommerenke, Bruce Archambeault, Zhiping Yang, Wheling Cheng, John Fisher, and Sergio Camerlo

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Matched Filter Detection and Identification of Electronic Circuits based on their Unintentional Radiated Emissions, Ahmed Shaik, Haixiao Weng, Xiaopeng Dong, Todd H. Hubing, and Daryl G. Beetner

Modeling and Design of Buried Capacitances for Power Distribution Networks on Multilayer Printed Circuit Board, Giuseppe Selli, Liang Xue, James L. Drewniak, Jun Fan, James L. Knighten, Chen Wang, Bruce Archambeault, and Samuel R. Connor

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Modeling of the IC's Switching Currents on the Power Bus of a High Speed Digital Board, Mauro Lai, James L. Drewniak, Vittorio Ricchiuti, Antonio Orlandi, and Giulio Antonini

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Numerical Analysis of Sandwiched Composite-FSS Structures, Rui Qiang, Ji Chen, Jingyu Huang, Marina Koledintseva, Richard E. DuBroff, James L. Drewniak, and Fan Yang

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Predicting TEM Cell Measurements from Near Field Scan Data, Haixiao Weng, Daryl G. Beetner, and Richard E. DuBroff

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Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements, Vijay Kasturi, Shaowei Deng, Todd H. Hubing, and Daryl G. Beetner

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Signal Link-Path Characterization Up to 20 GHz Based on a Stripline Structure, Jianmin Zhang, James L. Drewniak, David Pommerenke, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John C. Fisher, and Sergio Camerlo

Submissions from 2005

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A Hybrid Approach to Decrease Port Influence in Transmission Line Characterization, Jianmin Zhang, David Pommerenke, James L. Drewniak, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John Fisher, and Sergio Camerlo

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A Three-Dimensional FDTD Subgridding Method with Separate Spatial and Temporal Subgridding Interfaces, Kai Xiao, David Pommerenke, and James L. Drewniak