Probe Characterization and Data Process for Current Reconstruction by Near Field Scanning Method
Abstract
Previously a measurement technique for ESD current spreading on a PCB using near field scanning was developed in order to connect the local ESD sensitivity to system level ESD failures in time and spatial domain. The concept of such scanning methodology is proved and several scanning results were processed. However the validation, precision and weakness of such methodology need to be further investigated before the application of such scanning methodology on complex circuit or system. This article investigates the current reconstruction by near field scanning technique and methodology. It studies the probe factors including coupling frequency response characterization and deconvolution method, spatial resolution for scanning and orthogonal-scan data combine process.
Recommended Citation
W. Huang et al., "Probe Characterization and Data Process for Current Reconstruction by Near Field Scanning Method," Proceedings of the 2010 Asia-Pacific Symposium on Electromagnetic Compatibility (2010, Bejing, China), pp. 467 - 470, Institute of Electrical and Electronics Engineers (IEEE), Apr 2010.
The definitive version is available at https://doi.org/10.1109/APEMC.2010.5475504
Meeting Name
2010 Asia-Pacific Symposium on Electromagnetic Compatibility (2010: Apr. 12-16, Bejing, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Complex Circuits; Coupling Frequencies; Current Reconstruction; Current Spreading; Data Process; Deconvolution Method; Measurement Techniques; Near-field Scanning; Scan Data; Spatial Domains; Spatial Resolution; System-level ESD; Electromagnetic Compatibility; Electromagnetism; Electrostatic Devices; Electrostatic Discharge; Frequency Response; Probes; Time Domain Analysis; Scanning
International Standard Book Number (ISBN)
978-1-4244-5621-5
International Standard Serial Number (ISSN)
2162-7673
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Apr 2010