Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2011

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Unbalanced Currents in Integrated Circuits and their Effect on TEM Cell Emissions, Kuifeng Hu, Haixiao Weng, Daryl G. Beetner, David Pommerenke, and James L. Drewniak

Submissions from 2010

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A New Mixing Rule for Predicting of Frequency-Dependent Material Parameters of Composites, Konstantin Rozanov, Marina Koledintseva, and James L. Drewniak

A Systematic Approach to PCB Material Characterization using Time Domain TRL Calibration, Victor Khilkevich, Marina Koledintseva, Vysakh Sivarajan, Dazhao Liu, Brice Achkir, Hongxia Ning, and James L. Drewniak

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Capacitance Calculation for Offset Via Structures using an Integral Approximation Approach Based on Finite Element Method, Hanfeng Wang, Yaojiang Zhang, James L. Drewniak, Jun Fan, and Bruce Archambeault

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Causal RLGC( Ƒ ) Models for Transmission Lines from Measured S-Parameters, Jianmin Zhang, James L. Drewniak, David Pommerenke, Marina Koledintseva, Richard E. DuBroff, Wheling Cheng, Zhiping Yang, Qinghua B. Chen, and Antonio Orlandi

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Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials, Jianfeng Xu, Marina Koledintseva, Yaojiang Zhang, Yongxue He, Bill Matlin, Richard E. DuBroff, James L. Drewniak, and Jianmin Zhang

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DC Blocking Via Structure Optimization and Measurement Correlation for SerDes Channels, Jianmin Zhang, Qinghua B. Chen, Jun Fan, James L. Drewniak, Antonio Orlandi, and Bruce Archambeault

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Design and Modeling for Chip-to-Chip Communication at 20 Gbps, Jianmin Zhang, Qinghua B. Chen, Kelvin Qiu, Antonio Ciccomancini Scogna, Martin Schauer, Gerardo Romo, James L. Drewniak, and Antonio Orlandi

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Effects of TVS Integration on System Level ESD Robustness, Wei Huang, Jeffrey C. Dunnihoo, and David Pommerenke

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Evaluation of Propagation Characteristics for PCB Traces with Periodic Roughness using ASM-FDTD Method, Minshen Wang, Rui Qiang, Ji Chen, Marina Koledintseva, Amendra Koul, and James L. Drewniak

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FDTD Modeling of Absorbing Materials for EMI Applications, Jianfeng Xu, Marina Koledintseva, Soumya De, Andriy V. Radchenko, Richard E. DuBroff, James L. Drewniak, Yongxue He, and Richard Johnson

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Field Injection Probes for Field Coupled Electrostatic Discharge Sensitivity Database of ICs, Zhen Li, Jiang Xiao, Byongsu Seol, Jongsung Lee, and David Pommerenke

Hardware-In-The-Loop Simulation of Hybrid Control Unit for 4x4 Military Vehicles, Seungtaek Jeong, H. Kim, K. Han, S. Kim, J. Yoo, Y. Lee, and DongHyun Kim

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Improvements in GMI Probe Design for Time-Domain Transient Current Measurements, Fan Zhou, Songping Wu, David Pommerenke, Yoshiki Kayano, Hiroshi Inoue, Kenji Tan, and Jun Fan

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Investigation of Noise Coupling from Switching Power Supply to Signal Nets, Songping Wu, Keong Kam, David Pommerenke, Bill Cornelius, Hao Shi, Matthew Herndon, and Jun Fan

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Measurement Methodology for Establishing an IC ESD Sensitivity Database, Zhen Li, Jiang Xiao, Byongsu Seol, Jongsung Lee, and David Pommerenke

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Measuring IC Switching Current Waveforms using a GMI Probe for Power Integrity Studies, Fan Zhou, Songping Wu, David Pommerenke, Yoshiki Kayano, Hiroshi Inoue, Kenji Tan, and Jun Fan

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Model for ESD LCD Upset of a Portable Product, Jiang Xiao, David Pommerenke, Fan Zhou, James L. Drewniak, Hideki Shumiya, Takashi Yamada, and Kenji Araki

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Modeling of Noise Coupling inside Multilayer Printed Circuit Boards using Cavity Model and Segmentation Technique, Zhenwei Yu, Jun Fan, Samuel R. Connor, Bruce Archambeault, and James L. Drewniak

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Modeling of the Immunity of ICs to EFTs, Ji Zhang, Jayong Koo, Daryl G. Beetner, Richard Moseley, Scott Herrin, and David Pommerenke

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Near Field Probe for Detecting Resonances in EMC Application, Jiang Xiao, Dazhao Liu, David Pommerenke, Wei Huang, Peng Shao, Xiao Li, Jin Min, and Giorgi Muchaidze

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Physics-Based Via Model Development and Verification, Jianmin Zhang, Qinghua B. Chen, Zhiping Yang, James L. Drewniak, and Antonio Orlandi

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Planar Transmission Line Method for Characterization of Printed Circuit Board Dielectrics, Jianmin Zhang, Marina Koledintseva, Giulio Antonini, James L. Drewniak, Antonio Orlandi, and Konstantin Rozanov

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Predicting of Wideband Electromagnetic Responses of Composites Containing Magnetic Inclusions, Konstantin Rozanov, Marina Koledintseva, and James L. Drewniak

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Probe Characterization and Data Process for Current Reconstruction by Near Field Scanning Method, Wei Huang, Dazhao Liu, Jiang Xiao, David Pommerenke, Jin Min, and Giorgi Muchaidze

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Stressed Jitter Analysis for Physical Link Characterization, Nitin Radhakrishnan, Brice Achkir, Jun Fan, and James L. Drewniak

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Stub Length Prediction for Back-Drilled Vias using a Fast Via Tool, Jianmin Zhang, Qinghua B. Chen, Hanfeng Wang, Jun Fan, Antonio Orlandi, and James L. Drewniak

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Surface Impedance Approach to Calculate Loss in Rough Conductor Coated with Dielectric Layer, Marina Koledintseva, Amendra Koul, Fan Zhou, James L. Drewniak, and Scott Hinaga

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor, Scott Hinaga, Marina Koledintseva, James L. Drewniak, Amendra Koul, and Fan Zhou

Submissions from 2009

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Active Probes for Creating H-Field Probes for Flat Frequency Response, Surbhi Mittal, Ji Zhang, David Pommerenke, James L. Drewniak, Kuifeng Hu, and Xiaopeng Dong

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A Nonlinear Microcontroller Power Distribution Network Model for the Characterization of Immunity to Electrical Fast Transients, Jayong Koo, Lijun Han, Scott Herrin, Richard Moseley, Ross Carlton, Daryl G. Beetner, and David Pommerenke

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Cavities' Identification Algorithm for Power Integrity Analysis of Complex Boards, S. Cicerone, Antonio Orlandi, Bruce Archambeault, Samuel R. Connor, Jun Fan, and James L. Drewniak

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Developing an SI Tool Set for Engineering Design Discovery, Physical Insight, and Education, Amendra Koul, Andrew Conrad, Russell Jackson, Alex Packard, Jianjian Song, Edward D. Wheeler, and James L. Drewniak

Development of a Concept Inventory Test for Signal and Power Integrity in Electronic Design, Jianjian Song, Edward D. Wheeler, David Pommerenke, and James L. Drewniak

Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor, Scott Hinaga, Marina Koledintseva, Praveen K. Reddy Anmula, and James L. Drewniak

Experimental Research on Wheel Slip Control for the HEV In-Wheel Motor Along the Rough Terrain with Rectangular Obstacles, J. I. Seo, K. Chang, S. K. Jung, H. S. Choi, J. Y. Kim, and DongHyun Kim

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Extraction of Equivalent Inductance in Package-PCB Hierarchical Power Distribution Network, Jingook Kim, Jaemin Kim, Liehui Ren, Jun Fan, Joungho Kim, and James L. Drewniak

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Frequency-Dependent Via Inductances for Accurate Power Distribution Network Modeling, Liehui Ren, Jingook Kim, Gang Feng, Bruce Archambeault, James L. Knighten, James L. Drewniak, and Jun Fan

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Impedance of an Infinitely Large Parallel-Plane Pair and Its Applications in Engineering Modeling, Arun Reddy Chada, Yaojiang Zhang, Gang Feng, James L. Drewniak, and Jun Fan

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Improved Technique for Extracting Parameters of Low-Loss Dielectrics on Printed Circuit Boards, Amendra Koul, Praveen K. Reddy Anmula, Marina Koledintseva, James L. Drewniak, and Scott Hinaga

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Investigation of Mixed-Mode Input Impedance of Multi-Layer Differential Vias for Impedance Matching with Traces, Hanfeng Wang, Wheling Cheng, Jianmin Zhang, John Fisher, Lin Zhu, James L. Drewniak, and Jun Fan

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Material Parameter Extraction using Time-Domain TRL (t-TRL) Measurements, Abhilash Rajagopal, Brice Achkir, Marina Koledintseva, Amendra Koul, and James L. Drewniak

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Measurement of Electromagnetic Parameters and FDTD Modeling of Ferrite Cores, Jianfeng Xu, Marina Koledintseva, Yongxue He, Richard E. DuBroff, James L. Drewniak, Bill Matlin, and Andrea Orlando

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Modeling of Shielding Composite Materials and Structures for Microwave Frequencies, Marina Koledintseva, James L. Drewniak, Richard E. DuBroff, Konstantin Rozanov, and Bruce Archambeault

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Using a Single-Ended TRL Calibration Pattern to De-Embed Coupled Transmission Lines, Jianmin Zhang, Qinghua B. Chen, Zhiqiang Qiu, James L. Drewniak, and Antonio Orlandi

Submissions from 2008

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A Concise Multiple Scattering Method for Via Array Analysis in a Circular Plate Pair, Yaojiang Zhang, Jun Fan, Arun Reddy Chada, and James L. Drewniak

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Analysis of Noise Coupling from Printed Circuit Board to Shielding Enclosure, Zhenwei Yu, Xiaopeng Dong, Jason A. Mix, Kevin P. Slattery, and Jun Fan

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Analysis of the Thermal Effects of GaAs FETs under the High-Power Electromagnetic Pulses, Jianfeng Xu, Wen-Yan Yin, Jun-Fa Mao, Le-Wei Li, and James L. Drewniak

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Aperture Modeling Using a Hybrid Method for RFI Analysis, Liehui Ren, Zhenwei Yu, Gang Feng, Francesco de Paulis, Yaojiang Zhang, Jun Fan, Xiaopeng Dong, Jason A. Mix, Daniel Hua, and Kevin P. Slattery

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Automated Near-Field Scanning to Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, and David Pommerenke