The Evaluation Method for ESD Immunity of Components in Terms of Soft Error

Abstract

A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming more refined, high speed and multifunction, that failure trend is getting more general. The importance of cooperation between set developer and component developer has been emphasized in ESD field. Especially, making a correlation in measurement and analytical method is very important. Through this paper, the evaluation method for ESD immunity of components will be suggested for designing ESD robust product.

Meeting Name

EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility (2011: Sep. 26-30, York, UK)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Analytical Method; Component-level; ESD; ESD Test; Evaluation Method; Soft-error; Electromagnetic Compatibility; Electromagnetism; Electrostatic Discharge; Electrostatic Devices; Component-level

International Standard Book Number (ISBN)

978-0-9541146-3-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Sep 2011

Link to Full Text

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