Capacitance Calculation for Offset Via Structures using an Integral Approximation Approach Based on Finite Element Method

Abstract

A simple yet efficient approach is presented to extract the via-plane capacitances for an offset via structure. According to the integral approximation approach, the geometry of offset via is first divided into several segments with equally distributed angles from the origin. The two-dimensional FEM method for the concentric case is used for each segment based on its pad-stack parameters. Then, the final offset via-plane capacitance is approximated as the average of these 'segmental' capacitance values. Numerical examples demonstrated that the combined method has similar accuracy with a three-dimensional solver but it has much higher efficiency in both CPU time and memory cost.

Meeting Name

43rd International Symposium on Microelectronics (2010: Oct. 31-Nov. 4, Raleigh, NC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Capacitance Calculation; Capacitance Values; Combined Method; Higher Efficiency; Integral Approximation; Numerical Example; Segment-Based; Three-Dimensional Solvers; Finite Element Method; Microelectronics; Capacitance; Integral Approximation Approach; Offset Via Structure; Via-Plane Capacitance

International Standard Book Number (ISBN)

978-1617823206

International Standard Serial Number (ISSN)

2380-4505

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2010 International Microelectronics Assembly and Packaging Society, All rights reserved.

Publication Date

01 Nov 2010

Link to Full Text

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