Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2015

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Prediction of Electrostatic Discharge (ESD) Soft Error on Two-Way Radio using ESD Simulation in CST and ESD Immunity Scanning Technique, Rosnah Antong, Danny Low, David Pommerenke, and Mohd Zaid Abdullah

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Prediction of Radiated Emissions from Cables over a Metal Plane using a SPICE Model, Guanghua Li, Wei Qian, Andriy V. Radchenko, Junping He, Gary Hess, Robert Hoeckele, Thomas Van Doren, David Pommerenke, and Daryl G. Beetner

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Prediction of Radiated Emissions from Cables with Multiple Connections to a Metal Plane, Guanghua Li, Gary Hess, Robert Hoeckele, Peter L. Jalbert, Victor Khilkevich, Thomas Van Doren, David Pommerenke, and Daryl G. Beetner

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Quantifying Radiation and Physics from Edge-Coupled Signal Connectors, Xinxin Tian, Matthew S. Halligan, Liangqi Gui, Xiao Li, Kiyeong Kim, Samuel R. Connor, Bruce Archambeault, Michael Andrew Cracraft, Albert E. Ruehli, Qingxia Li, David Pommerenke, and James L. Drewniak

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Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media, Arun Reddy Chada, Bhyrav Mutnury, Jun Fan, and James L. Drewniak

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Radiation Physics from Two-Wire Transmission Lines, Jing Li, Yaojiang Zhang, Dazhao Liu, Alpesh U. Bhobe, James L. Drewniak, and Jun Fan

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Signal Integrity Design of Bump-Less Interconnection for High-Speed Signaling in 2.5D and 3D IC, Hyunsuk Lee, Heegon Kim, Sumin Choi, DongHyun Kim, Kyungjun Cho, and Joungho Kim

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Spark-Less Electrostatic Discharge (EDS) on Display Screens, Atieh Talebzadeh, Yingjie Gan, Kihyuk Kim, Yiqiang Zhang, and David Pommerenke

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Stable Recursive Convolution for Channel Response Calculation with Causality Enforcement, Mikheil Tsiklauri, Mikhail Zvonkin, Nana Dikhaminjia, Jun Fan, and James L. Drewniak

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Studying the Effect of Drilling Uncertainty on Signal Propagation through Vias, Yansheng Wang, Srinath Penugonda, Yaojiang Zhang, Ji Chen, and Jun Fan

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Surface Current Distribution for PCB PDNGeometry, Biyao Zhao, Siqi Bai, Chenxi Huang, Jun Fan, Albert E. Ruehli, James L. Drewniak, Brice Achkir, Hanqin Ye, Erping Li, Bruce Archambeault, Samuel Connor, Michael Cracraft, and Matteo Cocchini

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System-Level Modeling for Transient Electrostatic Discharge Simulation, Tianqi Li, Viswa Pilla, Zhen Li, Junji Maeshima, Hideki Shumiya, Kenji Araki, and David Pommerenke

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Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance, S. Piersanti, F. De Paulis, A. Orlandi, DongHyun Kim, Jonghyun Cho, and Joungho Kim

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Thumb Joint Angle Estimation for Soft Wearable Hand Robotic Devices, DongHyun Kim and Hyung-Soon Park

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Ultra-Thin Printed Circuit Board Metamaterial for High Efficiency Wireless Power Transfer, Yeonje Cho; Hongseok Kim; Chiuk Song; Jinwook Song; DongHyun Kim; and For full list of authors, see publisher's website.

Vectorless Prediction of Simultaneous Switching Noise from FPGAS, Chunchun Sui, Liehui Ren, Daryl G. Beetner, and James L. Drewniak

Submissions from 2014

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0.7-20-GHz Dual-Polarized Bilateral Tapered Slot Antenna for EMC Measurements, Fenghan Lin, Yihong Qi, Jun Fan, and Yongchang Jiao

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A Methodology to Generate a Time-Varying Adjustable Wave Impedance inside a TEM Cell, Guanghua Li, Venkata Anand Prabhala, Abhinav Saxena, Qian Wang, Pratik Maheshwari, and David Pommerenke

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A Method to Quantify the Coupling between DVI and HDMI Connectors, Abhishek Patnaik, Yaojiang Zhang, Soumya De, David Pommerenke, Chen Wang, and Charles Jackson

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A Multi-Coil Magneto-Inductive Transceiver for Low-Cost Wireless Sensor Networks, Niaz Ahmed, Justin Hoyt, Andriy V. Radchenko, David Pommerenke, and Y. Rosa Zheng

Analysis of Current Sharing in Large and Small-Signal IC Pin Models, Benjamin Orr, Pratik Maheshwari, David Pommerenke, Harald Gossner, and Wolfgang Stadler

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Analysis of Wireless Power Transfer system design on active silicon interposer for low voltage applications in 3D-IC, Jinwook Song, Sukjin Kim, Bumhee Bae, Hongseok Kim, Jonghoon J. Kim, DongHyun Kim, and Joungho Kim

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Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer with Arbitrary Power-Supply Voltage Fluctuations, Jingook Kim, Junho Lee, Sunki Cho, Chulsoon Hwang, Changwook Yoon, and Jun Fan

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An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects, Xinyao Guo, David R. Jackson, Marina Koledintseva, Scott Hinaga, James L. Drewniak, and Ji Chen

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An Efficient Hybrid Boundary-Integral and Finite-Element Method for Signal Integrity Analysis of Multiple Vias Sharing an Anti-Pad in an Infinitely-Large Plate Pair, Yaojiang Zhang, Xinxin Tian, Liehui Ren, Dazhao Liu, and Jun Fan

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An Ethernet Cable Discharge Event (CDE) Test and Measurement System, Wei Huang, Jerry Tichenor, David Pommerenke, Viswa Pilla, Pratik Maheshwari, and Giorgi Maghlakelidze

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A New Tail-Fit Method Design for Jitter Decomposition, Chunchun Sui, Daryl G. Beetner, Ting Zhu, and Christopher Cheng

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An Experimental Approach for Locating the Current Distribution in Multiphase Buck Converters, Peng Shao, Frank Chang, Chris Reade, Ponniah Ilavarasan, and David Pommerenke

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Application of Emission Source Microscopy Technique to EMI Source Localization above 5 GHz, Pratik Maheshwari, Victor Khilkevich, David Pommerenke, Hamed Kajbaf, and Jin Min

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A Resonant E-field Probe for RFI Measurements, Guanghua Li, Koichi Itou, Yoshihiro Katou, Noriyuki Mukai, David Pommerenke, and Jun Fan

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Causality and Delay and Physics in Real Systems, Mikheil Tsiklauri, Mikhail Zvonkin, Jun Fan, James L. Drewniak, Qinghuabill Chen, and Alexander G. Razmadze

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Characterization of PCB Dielectric Properties using Two Striplines on the Same Board, Lei Hua, Bichen Chen, Shuai Jim, Marina Koledintseva, Jame Lim, Kelvin Qiu, Rick Brooks, Ji Zhang, Ketan Shringarpure, and Jun Fan

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Closed-Form Expressions for the Noise Voltage Caused by a Burst Train of IC Switching Currents on a Power Distribution Network, Jingook Kim, Jongjoo Lee, Seungyoung Ahn, and Jun Fan

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Coaxial Cable Bragg Grating Assisted Microwave Coupler, Jie Huang, Tao Wei, Jun Fan, and Hai Xiao

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Comparison of Magnetic Probe Calibration at Nano and Millitesla Magnitudes, Ryan A. Pahl, Joshua L. Rovey, and David Pommerenke

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Conducted-Emission Modeling for a High-Speed ECL Clock Buffer, Shuai Jin, Yaojiang Zhang, Yan Zhou, Yadong Bai, Xuequan Yu, and Jun Fan

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Control of Critical Coupling in a Coiled Coaxial Cable Resonator, Jie Huang, Tao Wei, Tao Wang, Jun Fan, and Hai Xiao

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Coupling Path Visualization using a Movable Scatterer, Sen Yang, Pratik Maheshwari, Victor Khilkevich, and David Pommerenke

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De-Embedding Method to Accurately Measure High-Frequency Impedance of an O-Shape Spring Contact, Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Yihong Qi, and Jun Fan

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De-Embedding Techniques for Transmission Lines: An Application to Measurements of On-Chip Coplanar Traces, Nicholas Erickson, Jun Fan, Xu Gao, Brice Achkir, and Siming Pan

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Design Criteria of Automatic Fixture Removal (AFR) for Asymmetric Fixture De-Embedding, Changwook Yoon, Mikheil Tsiklauri, Mikhail Zvonkin, Jun Fan, James L. Drewniak, Alexander G. Razmadze, Aman Aflaki, Jingook Kim, and Qinghuabill Chen

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Designing a 3D Printing Based Channel Emulator, Xiangyang Jiao, Hui He, Guanghua Li, Wei Qian, Guangyao Shen, David Pommerenke, Chong Ding, Douglas B. White, Stephen A. Scearce, and Yaochao Yang

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Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer, Qian Wang, Ketan Shringarpure, Jun Fan, Chulsoon Hwang, Siming Pan, and Brice Achkir

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Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications, Francesco de Paulis, Muhammet Hilmi Nisanci, Antonio Orlandi, Marina Koledintseva, and James L. Drewniak

Determination of the Effect of Humidity on the Probability of ESD Failure or Upset in Data Centers, Mahdi Moradian, Abhishek Patnaik, Yunan Han, Fayu Wan, Xu Gao, David Pommerenke, and David E. Swenson

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Effectiveness Analysis of De-Embedding Method for Typical TSV Pairs in a Silicon Interposer, Qian Wang, Ketan Shringarpure, Bichen Chen, Jun Fan, Chulsoon Hwang, Siming Pan, and Brice Achkir

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Effect of Narrow Power Fills on PCB PDN Noise, Ketan Shringarpure, Biyao Zhao, Bruce Archambeault, Albert E. Ruehli, Jun Fan, and James L. Drewniak

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Electro-Mechanical Structures for Channel Emulation, Satyajeet R. Shinde, Sen Yang, Nicholas Erickson, David Pommerenke, Chong Ding, Douglas B. White, Stephen A. Scearce, and Yaochao Yang

Elimination of Conductor Foil Roughness Effects in Characterization of Dielectric Properties of Printed Circuit Boards, Marina Koledintseva, Aleksei V. Rakov, Alexei I. Koledintsev, James L. Drewniak, and Scott Hinaga

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EMI Mitigation with Lossy Material at 10 GHz, Xiangyang Jiao, Pratik Maheshwari, Victor Khilkevich, Paul Dixon, Yoeri Ariën, Alpesh U. Bhobe, Jing Li, Xiao Li, David Pommerenke, James L. Drewniak, Hamed Kajbaf, and Jin Min