Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

Follow


Submissions from 2015

Link

Stable Recursive Convolution for Channel Response Calculation with Causality Enforcement, Mikheil Tsiklauri, Mikhail Zvonkin, Nana Dikhaminjia, Jun Fan, and James L. Drewniak

Link

Studying the Effect of Drilling Uncertainty on Signal Propagation through Vias, Yansheng Wang, Srinath Penugonda, Yaojiang Zhang, Ji Chen, and Jun Fan

Link

Surface Current Distribution for PCB PDNGeometry, Biyao Zhao, Siqi Bai, Chenxi Huang, Jun Fan, Albert E. Ruehli, James L. Drewniak, Brice Achkir, Hanqin Ye, Erping Li, Bruce Archambeault, Samuel Connor, Michael Cracraft, and Matteo Cocchini

Link

System-Level Modeling for Transient Electrostatic Discharge Simulation, Tianqi Li, Viswa Pilla, Zhen Li, Junji Maeshima, Hideki Shumiya, Kenji Araki, and David Pommerenke

Link

Through Silicon Via Time Domain Crosstalk Modeling Considering Hysteretic Coupling Capacitance, S. Piersanti, F. De Paulis, A. Orlandi, DongHyun Kim, Jonghyun Cho, and Joungho Kim

Link

Thumb Joint Angle Estimation for Soft Wearable Hand Robotic Devices, DongHyun Kim and Hyung-Soon Park

Link

Ultra-Thin Printed Circuit Board Metamaterial for High Efficiency Wireless Power Transfer, Yeonje Cho; Hongseok Kim; Chiuk Song; Jinwook Song; DongHyun Kim; and For full list of authors, see publisher's website.

Vectorless Prediction of Simultaneous Switching Noise from FPGAS, Chunchun Sui, Liehui Ren, Daryl G. Beetner, and James L. Drewniak

Submissions from 2014

Link

0.7-20-GHz Dual-Polarized Bilateral Tapered Slot Antenna for EMC Measurements, Fenghan Lin, Yihong Qi, Jun Fan, and Yongchang Jiao

Link

A Methodology to Generate a Time-Varying Adjustable Wave Impedance inside a TEM Cell, Guanghua Li, Venkata Anand Prabhala, Abhinav Saxena, Qian Wang, Pratik Maheshwari, and David Pommerenke

Link

A Method to Quantify the Coupling between DVI and HDMI Connectors, Abhishek Patnaik, Yaojiang Zhang, Soumya De, David Pommerenke, Chen Wang, and Charles Jackson

Link

A Multi-Coil Magneto-Inductive Transceiver for Low-Cost Wireless Sensor Networks, Niaz Ahmed, Justin Hoyt, Andriy V. Radchenko, David Pommerenke, and Y. Rosa Zheng

Analysis of Current Sharing in Large and Small-Signal IC Pin Models, Benjamin Orr, Pratik Maheshwari, David Pommerenke, Harald Gossner, and Wolfgang Stadler

Link

Analysis of Wireless Power Transfer system design on active silicon interposer for low voltage applications in 3D-IC, Jinwook Song, Sukjin Kim, Bumhee Bae, Hongseok Kim, Jonghoon J. Kim, DongHyun Kim, and Joungho Kim

Link

Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer with Arbitrary Power-Supply Voltage Fluctuations, Jingook Kim, Junho Lee, Sunki Cho, Chulsoon Hwang, Changwook Yoon, and Jun Fan

Link

An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects, Xinyao Guo, David R. Jackson, Marina Koledintseva, Scott Hinaga, James L. Drewniak, and Ji Chen

Link

An Efficient Hybrid Boundary-Integral and Finite-Element Method for Signal Integrity Analysis of Multiple Vias Sharing an Anti-Pad in an Infinitely-Large Plate Pair, Yaojiang Zhang, Xinxin Tian, Liehui Ren, Dazhao Liu, and Jun Fan

Link

An Ethernet Cable Discharge Event (CDE) Test and Measurement System, Wei Huang, Jerry Tichenor, David Pommerenke, Viswa Pilla, Pratik Maheshwari, and Giorgi Maghlakelidze

Link

A New Tail-Fit Method Design for Jitter Decomposition, Chunchun Sui, Daryl G. Beetner, Ting Zhu, and Christopher Cheng

Link

An Experimental Approach for Locating the Current Distribution in Multiphase Buck Converters, Peng Shao, Frank Chang, Chris Reade, Ponniah Ilavarasan, and David Pommerenke

Link

Application of Emission Source Microscopy Technique to EMI Source Localization above 5 GHz, Pratik Maheshwari, Victor Khilkevich, David Pommerenke, Hamed Kajbaf, and Jin Min

Link

A Resonant E-field Probe for RFI Measurements, Guanghua Li, Koichi Itou, Yoshihiro Katou, Noriyuki Mukai, David Pommerenke, and Jun Fan

Link

Causality and Delay and Physics in Real Systems, Mikheil Tsiklauri, Mikhail Zvonkin, Jun Fan, James L. Drewniak, Qinghuabill Chen, and Alexander G. Razmadze

Link

Characterization of PCB Dielectric Properties using Two Striplines on the Same Board, Lei Hua, Bichen Chen, Shuai Jim, Marina Koledintseva, Jame Lim, Kelvin Qiu, Rick Brooks, Ji Zhang, Ketan Shringarpure, and Jun Fan

Link

Closed-Form Expressions for the Noise Voltage Caused by a Burst Train of IC Switching Currents on a Power Distribution Network, Jingook Kim, Jongjoo Lee, Seungyoung Ahn, and Jun Fan

Link

Coaxial Cable Bragg Grating Assisted Microwave Coupler, Jie Huang, Tao Wei, Jun Fan, and Hai Xiao

PDF

Comparison of Magnetic Probe Calibration at Nano and Millitesla Magnitudes, Ryan A. Pahl, Joshua L. Rovey, and David Pommerenke

Link

Conducted-Emission Modeling for a High-Speed ECL Clock Buffer, Shuai Jin, Yaojiang Zhang, Yan Zhou, Yadong Bai, Xuequan Yu, and Jun Fan

Link

Control of Critical Coupling in a Coiled Coaxial Cable Resonator, Jie Huang, Tao Wei, Tao Wang, Jun Fan, and Hai Xiao

Link

Coupling Path Visualization using a Movable Scatterer, Sen Yang, Pratik Maheshwari, Victor Khilkevich, and David Pommerenke

Link

De-Embedding Method to Accurately Measure High-Frequency Impedance of an O-Shape Spring Contact, Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Yihong Qi, and Jun Fan

Link

De-Embedding Techniques for Transmission Lines: An Application to Measurements of On-Chip Coplanar Traces, Nicholas Erickson, Jun Fan, Xu Gao, Brice Achkir, and Siming Pan

Link

Design Criteria of Automatic Fixture Removal (AFR) for Asymmetric Fixture De-Embedding, Changwook Yoon, Mikheil Tsiklauri, Mikhail Zvonkin, Jun Fan, James L. Drewniak, Alexander G. Razmadze, Aman Aflaki, Jingook Kim, and Qinghuabill Chen

Link

Designing a 3D Printing Based Channel Emulator, Xiangyang Jiao, Hui He, Guanghua Li, Wei Qian, Guangyao Shen, David Pommerenke, Chong Ding, Douglas B. White, Stephen A. Scearce, and Yaochao Yang

Link

Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer, Qian Wang, Ketan Shringarpure, Jun Fan, Chulsoon Hwang, Siming Pan, and Brice Achkir

Link

Design of Homogeneous and Composite Materials from Shielding Effectiveness Specifications, Francesco de Paulis, Muhammet Hilmi Nisanci, Antonio Orlandi, Marina Koledintseva, and James L. Drewniak

Determination of the Effect of Humidity on the Probability of ESD Failure or Upset in Data Centers, Mahdi Moradian, Abhishek Patnaik, Yunan Han, Fayu Wan, Xu Gao, David Pommerenke, and David E. Swenson

Link

Effectiveness Analysis of De-Embedding Method for Typical TSV Pairs in a Silicon Interposer, Qian Wang, Ketan Shringarpure, Bichen Chen, Jun Fan, Chulsoon Hwang, Siming Pan, and Brice Achkir

Link

Effect of Narrow Power Fills on PCB PDN Noise, Ketan Shringarpure, Biyao Zhao, Bruce Archambeault, Albert E. Ruehli, Jun Fan, and James L. Drewniak

Link

Electro-Mechanical Structures for Channel Emulation, Satyajeet R. Shinde, Sen Yang, Nicholas Erickson, David Pommerenke, Chong Ding, Douglas B. White, Stephen A. Scearce, and Yaochao Yang

Elimination of Conductor Foil Roughness Effects in Characterization of Dielectric Properties of Printed Circuit Boards, Marina Koledintseva, Aleksei V. Rakov, Alexei I. Koledintsev, James L. Drewniak, and Scott Hinaga

Link

EMI Mitigation with Lossy Material at 10 GHz, Xiangyang Jiao, Pratik Maheshwari, Victor Khilkevich, Paul Dixon, Yoeri Ariën, Alpesh U. Bhobe, Jing Li, Xiao Li, David Pommerenke, James L. Drewniak, Hamed Kajbaf, and Jin Min

Link

Emulation of Lossy Channels using a Low Loss Microstrip Trace with Added Lossy Materials, Wei Qian, Guanghua Li, Pratik Maheshwari, Victor Khilkevich, David Pommerenke, Chong Ding, Douglas B. White, Stephen A. Scearce, and Yaochao Yang

Link

Estimation of Mode Conversion and Crosstalk Impact from a Single-Ended Aggressor to a Differential Victim using Statistical BER Analysis, Arun Reddy Chada, Jun Fan, James L. Drewniak, and Bhyrav Mutnury

Link

Far-Field Prediction using Only Magnetic Near-Field Scanning for EMI Test, Xu Gao, Jun Fan, Yaojiang Zhang, Hamed Kajbaf, and David Pommerenke

Link

Far-Field Radiation Estimation from Near-Field Measurements and Image Theory, Jingnan Pan, Xu Gao, Yaojiang Zhang, and Jun Fan

PDF

First Demonstration of Ultra-Thin SiGe-Channel Junctionless Accumulation-Mode (JAM) Bulk FinFETs on Si Substrate with PN Junction-Isolation Scheme, DongHyun Kim, Tae Kyun Kim, Young Gwang Yoon, Byeong Woon Hwang, Yang-Kyu Choi, Byung Jin Cho, and Seok-Hee Lee

Link

Identification and Visualization of Coupling Paths - Part I: Energy Parcel and Its Trajectory, Hongyu Li, Victor Khilkevich, and David Pommerenke

Link

Identification and Visualization of Coupling Paths - Part II: Practical Application, Hongyu Li, Victor Khilkevich, and David Pommerenke

Link

Implementation of a 18 GHz Bandwidth Channel Emulator using an FIR Filter, Abhishek Patnaik, Atieh Talebzadeh, Mikheil Tsiklauri, David Pommerenke, Chong Ding, Douglas B. White, Stephen A. Scearce, and Yaochao Yang