Surface Impedance Approach to Calculate Loss in Rough Conductor Coated with Dielectric Layer
Abstract
The analysis presented herein contains closed-form analytical expressions to calculate attenuation in a layered structure "rough metal-dielectric-dielectric", which is a practically important problem in separating dielectric loss from rough conductor loss in actual PCB stripline geometries, when measuring dielectric constant (Dk) and dissipation factor (Df) using travelling wave S-parameter methods. This approach is based on the surface impedance concept. It is shown that the presence of an epoxy layer on the conductor may affect extracted dielectric parameters, of a PCB substrate, especially the Df data.
Recommended Citation
M. Koledintseva et al., "Surface Impedance Approach to Calculate Loss in Rough Conductor Coated with Dielectric Layer," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2010, Fort Lauderdale, FL), pp. 790 - 795, Institute of Electrical and Electronics Engineers (IEEE), Jul 2010.
The definitive version is available at https://doi.org/10.1109/ISEMC.2010.5711380
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2010: Jul. 25-30, Fort Lauderdale, FL)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Analytical Expressions; Closed Form; Conductor Loss; Dielectric Constants; Dielectric Layer; Dielectric Parameters; Dissipation Factors; Epoxy Layers; Layered Structures; S Parameters; Strip Line; Surface Impedances; Travelling Waves; Electromagnetic Compatibility; Electromagnetism; Organic Pollutants; Polychlorinated Biphenyls; Scattering Parameters; Dielectric Losses; Surface Impedance, Dielectrics; Surface Roughness; Corrugated Surfaces; Conductors; Impedance; Permittivity; Printed Circuit Design; Epoxy Layer; Rough Conductor; Rough Metal-Dielectric-Dielectric Structure; Dielectric Loss; PCB Stripline Geometries; Dielectric Constant; Dissipation Factor; Travelling Wave S-Parameter Method
International Standard Book Number (ISBN)
978-1424463053; 978-1424463084
International Standard Serial Number (ISSN)
2158-1118; 2158-110X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2010
