Submissions from 2002
Anticipating Full Vehicle Radiated EMI from Module-Level Testing in Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, and James L. Drewniak
Application of Higher-Order FEM Elements to the Analysis of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff
Efficient Modeling of Discontinuities and Dispersive Media in Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, and S. Celozzi
Estimating the Noise Mitigation Effect of Local Decoupling in Printed Circuit Boards, Jun Fan, Wei Cui, James L. Drewniak, Thomas Van Doren, and James L. Knighten
External Parasitic Inductance in Microstrip and Stripline Geometries of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, and David M. Hockanson
Eye Pattern Evaluation in High-Speed Digital Systems Analysis by using MTL Modeling, Giulio Antonini, James L. Drewniak, Antonio Orlandi, and Vittorio Ricchiuti
FDTD Analysis of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, and James L. Drewniak
FDTD Modeling Incorporating a Two-Port Network for I/O Line EMI Filtering Design, Xiaoning Ye and James L. Drewniak
FDTD Modeling of Skin Effect, Chen Wang, James L. Drewniak, Min Li, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, and Jingyu Huang
Field Extraction from Near Field Scanning for a Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. DuBroff, James L. Drewniak, David Pommerenke, and Todd H. Hubing
High-Performance Inter-PCB Connectors: Analysis of EMI Characteristics, Xiaoning Ye, James L. Drewniak, Jim Nadolny, and David M. Hockanson
Modeling Noise Coupling from Non-Parallel PCB Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, and Richard E. DuBroff
Transmission Line Modeling of Vias in Differential Signals, Chen Wang, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, and Ray Alexander
Submissions from 2001
An EMI Estimate for Shielding-Enclosure Evaluation, Min Li, James L. Drewniak, S. Radu, Joe Nuebel, Todd H. Hubing, Richard E. DuBroff, and Thomas Van Doren
DC Power-Bus Design using FDTD Modeling with Dispersive Media and Surface Mount Technology Components, Xiaoning Ye, Marina Koledintseva, Min Li, and James L. Drewniak
DC Power-Bus Modeling and Design with a Mixed-Potential Integral-Equation Formulation and Circuit Extraction, Jun Fan, James L. Drewniak, Hao Shi, and James L. Knighten
DC Power Bus Noise Isolation with Power Islands, Wei Cui, Jun Fan, Hao Shi, and James L. Drewniak
Differential Signalling in PCBs: Modeling and Validation of Dielectric Losses and Effects of Discontinuities, R. Araneo, Chen Wang, Xiaoxiong Gu, S. Celozzi, and James L. Drewniak
EMI Considerations in Selecting Heat-Sink-Thermal-Gasket Materials, Yu Huang, J. E. Butler, M. de Sorgo, Richard E. DuBroff, Todd H. Hubing, James L. Drewniak, and Thomas Van Doren
EMI Mitigation with Multilayer Power-Bus Stacks and Via Stitching of Reference Planes, Xiaoning Ye, David M. Hockanson, Min Li, Yong Ren, Wei Cui, James L. Drewniak, and Richard E. DuBroff
FDTD and Experimental Investigation of EMI from Stacked-Card PCB Configurations, David M. Hockanson, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, and Richard E. DuBroff
Grounding of Heatpipe/Heatspreader and Heatsink Structures for EMI Mitigation, Chen Wang, James L. Drewniak, D. Wang, Ray Alexander, James L. Knighten, and David M. Hockanson
Improving the High-Frequency Attenuation of Shunt Capacitor, Low-Pass Filters, Christopher N. Olsen, Thomas Van Doren, Todd H. Hubing, James L. Drewniak, and Richard E. DuBroff
Including SMT Ferrite Beads in DC Power Bus and High-Speed I/O Line Modeling, Jun Fan, Shaofeng Luan, and James L. Drewniak
Incorporating Two-Port Networks with S-Parameters into FDTD, Xiaoning Ye and James L. Drewniak
Investigation of PCB Layout Parasitics in EMI Filtering of I/O Lines, Xiaoning Ye, Geping Liu, and James L. Drewniak
Mitigating Power Bus Noise with Embedded Capacitance in PCB Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff
Modeling DC Power-Bus Structures with Vertical Discontinuities using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation, Jun Fan, Hao Shi, Antonio Orlandi, James L. Knighten, and James L. Drewniak
Modeling Shared-Via Decoupling in a Multi-Layer Structure Using the CEMPIE Approach, Wei Cui, Jun Fan, Shaofeng Luan, and James L. Drewniak
Quantifying SMT Decoupling Capacitor Placement in dc Power-Bus Design for Multilayer PCBs, Jun Fan, James L. Drewniak, James L. Knighten, Norman W. Smith, Antonio Orlandi, Thomas Van Doren, Todd H. Hubing, and Richard E. DuBroff
Representation of Gyromagnetic Composite Media for FDTD Modeling, Marina Koledintseva, James L. Drewniak, and Xiaoning Ye
The Effects of Via Transitions on Differential Signals, Chen Wang, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, and James L. Drewniak
Submissions from 2000
A Common-Mode Current Measurement Technique for EMI Performance Evaluation of PCB Structures, Xiaoning Ye, David M. Hockanson, and James L. Drewniak
DC Power Bus Design with FDTD Modeling Including a Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, and James L. Drewniak
DC Power Bus Modeling in High-Speed Digital Designs Including Conductor and Dielectric Losses, Jun Fan, Hao Shi, James L. Knighten, and James L. Drewniak
DC Power Bus Modeling using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation and an Iterative Equation Solver, Jun Fan, James L. Drewniak, and James L. Knighten
Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, and James L. Drewniak
EMC Analysis of an 18" LCD Monitor, Theodore M. Zeeff, Todd H. Hubing, James L. Drewniak, Richard E. DuBroff, and Thomas Van Doren
EMI from Airflow Aperture Arrays in Shielding Enclosures-Experiments, FDTD, and MoM Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. DuBroff, Todd H. Hubing, and Thomas Van Doren
EMI from Cavity Modes of Shielding Enclosures-FDTD Modeling and Measurements, Min Li, Joe Nuebel, James L. Drewniak, Richard E. DuBroff, Todd H. Hubing, and Thomas Van Doren
EMI Reduction from Airflow Aperture Arrays using Dual-Perforated Screens and Loss, Min Li, Joe Nuebel, James L. Drewniak, Todd H. Hubing, Richard E. DuBroff, and Thomas Van Doren
EMI Resulting from a Signal Via Transition Through DC Power Bus-Effectiveness of Focal SMT Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, and James L. Drewniak
EMI Resulting from Signal Via Transitions through the DC Power Bus, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, and James L. Drewniak
Experimental and FDTD Study of the EMI Performance of an Open-Pin-Field Connector for Modules-on-Backplanes, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Richard E. DuBroff, Thomas Van Doren, and Todd H. Hubing
Experimental and Numerical Study of the Radiation from Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff
Experimental Evaluation of Power Bus Decoupling on a 4-Layer Printed Circuit Board, Juan Chen, Minjia Xu, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff
FDTD and FEM/MOM Modeling of EMI Resulting from a Trace Near a PCB Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. DuBroff, and Thomas Van Doren
FDTD Modeling of Lumped Ferrites, Min Li, Xiao Luo, and James L. Drewniak
Finite Element Modeling of Patch Antenna and Cavity Sources, Yun Ji, Todd H. Hubing, and James L. Drewniak
Modeling EMI Resulting from a Signal Via Transition Through Power/Ground Layers, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, and James L. Drewniak
