Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

Follow


Submissions from 2005

PDF

Complex Power Distribution Network Investigation using SPICE Based Extraction from First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean McCoy, Bruce Archambeault, Stefano Grivet-Talocia, and Flavio G. Canavero

PDF

Coupling Between Differential Signals and the DC Power-Bus in Multilayer PCBs, Chen Wang, Marco Leone, James L. Drewniak, and Antonio Orlandi

PDF

Engineering of Composite Media for Shields at Microwave Frequencies, Marina Koledintseva, Poorna Chander Ravva, Richard E. DuBroff, James L. Drewniak, Konstantin Rozanov, and Bruce Archambeault

PDF

Neural Network Detection and Identification of Electronic Devices based on their Unintended Emissions, Haixiao Weng, Xiaopeng Dong, Xiao Hu, Daryl G. Beetner, Todd H. Hubing, and Donald C. Wunsch

PDF

Power Integrity Investigation of BGA Footprints by Means of the Segmentation Method, Giuseppe Selli, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean McCoy, and Bruce Archambeault

PDF

Validation of Circuit Extraction Procedure by Means of Frequency and Time Domain Measurement, Giulio Antonini, Antonio Ciccomancini Scogna, Antonio Orlandi, Vittorio Ricchiuti, Giuseppe Selli, Shaofeng Luan, and James L. Drewniak

PDF

Wide-Band Lorentzian Media in the FDTD Algorithm, Marina Koledintseva, James L. Drewniak, David Pommerenke, Giulio Antonini, Antonio Orlandi, and Konstantin Rozanov

Submissions from 2004

3D Modeling and Circuit Model Extraction of Vias in Multilayer Printed Circuit Boards, Giuseppe Selli, Jianmin Zhang, Mauro Lai, Andrea de Luca, Antonio Ciccomancini, Bruce Archambeault, Giulio Antonini, James L. Drewniak, Antonio Orlandi, Jun Fan, and James L. Knighten

PDF

A Circuit Approach to Model Narrow Slot Structures in a Power Bus, Lin Zhang, Ray Alexander, Richard E. DuBroff, James L. Drewniak, James L. Knighten, Norman W. Smith, Bruce Archambeault, Samuel R. Connor, and Jun Fan

PDF

An Extrapolation Procedure to Shorten Time Domain Simulations, Giuseppe Selli, James L. Drewniak, and David Pommerenke

PDF

Anticipating EMI and On-Board Interference in Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, and Chingchi Chen

PDF

A Three-Dimensional FDTD Subgridding Algorithm Based on Interpolation of Current Density, Kai Xiao, David Pommerenke, and James L. Drewniak

PDF

A Time Domain Approach to Estimate Current Draw from SMT Decoupling Capacitors, Lin Zhang, Bruce Archambeault, Samuel Conner, James L. Knighten, Jun Fan, Norman W. Smith, Ray Alexander, Richard E. DuBroff, and James L. Drewniak

PDF

Common-Mode Current Due to a Trace Near a PCB Edge and its Suppression by a Guard Band, Yoshiki Kayano, Motoshi Tanaka, James L. Drewniak, and Hiroshi Inoue

PDF

Comparison of Via Equivalent Circuit Model Accuracy using Quasi-Static and Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, and Albert E. Ruehli

PDF

Effects of Open Stubs Associated with Plated Through-Hole Vias in Backpanel Designs, Shaowei Deng, Jingkun Mao, Todd H. Hubing, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, and Chen Wang

Efficient Capacitance Calculations for PEEC Circuit Analysis, Jingkun Mao, Giulio Antonini, Antonio Orlandi, and James L. Drewniak

PDF

Electrical Material Property Measurements using a Free-Field, Ultra-Wideband System [Dielectric Measurements], C. A. Grosvenor, R. Johnk, D. Novotny, S. Canales, J. Baker-Jarvis, M. Janezic, James L. Drewniak, Marina Koledintseva, Jianmin Zhang, and Poorna Chander Ravva

PDF

Electromagnetic Interference (EMI) of System-on-Package (SOP), Toshio Sudo, Hideki Sasaki, Norio Masuda, and James L. Drewniak

PDF

Expert System Algorithms for Identifying Radiated Emission Problems in Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. DuBroff, James L. Drewniak, David Pommerenke, and R. Kaires

PDF

Extracting R, L, G, C Parameters of Dispersive Planar Transmission Lines from Measured S-Parameters using a Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, Giulio Antonini, Antonio Orlandi, and Konstantin Rozanov

PDF

Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling, Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea de Luca, Giulio Antonini, Antonio Orlandi, Antonio Ciccomancini Scogna, Jun Fan, James L. Knighten, Norman W. Smith, and Ray Alexander

PDF

Extraction of SPICE-Type Equivalent Circuits of Signal Via Transitions using the PEEC Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, and Antonio Orlandi

PDF

Representation of Permittivity for Multiphase Dielectric Mixtures in FDTD Modeling, Marina Koledintseva, J. Wu, H. Zhang, James L. Drewniak, and Konstantin Rozanov

PDF

Static and Quasi-Dynamic Load Balancing in Parallel FDTD Codes for Signal Integrity, Power Integrity, and Packaging Applications, Sarah A. Seguin, Michael A. Cracraft, and James L. Drewniak

PDF

Susceptibility Characterization of a Cavity with an Aperture by using Slowly Rotating EM Fields: FDTD Analysis and Measurements, Kimitoshi Murano, Takeshi Sanpei, Fengchao Xiao, Chen Wang, Yoshio Kami, and James L. Drewniak

PDF

The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained From Numerical Modeling, Shaofeng Luan, Jun Fan, James L. Knighten, and Norman W. Smith

PDF

Validation of Equivalent Circuits Extracted from S-Parameter Data for Eye-pattern Evaluation, Giuseppe Selli, Mauro Lai, Shaofeng Luan, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, Norman W. Smith, Giulio Antonini, Antonio Orlandi, Bruce Archambeault, and Samuel R. Connor

Submissions from 2003

PDF

A Dual-current Method for Characterizing Common-Mode Loop Impedance, Geping Liu, Yimin Ding, Chingchi Chen, Richard W. Kautz, James L. Drewniak, David Pommerenke, and Marina Koledintseva

PDF

Anticipating EMI using Transfer Functions and Signal Integrity Information, Chen Wang, James L. Drewniak, and Jim Nadolny

PDF

Anticipating Vehicle-Level EMI using a Multi-Step Approach, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, and Chingchi Chen

Link

Common-Mode and Differential-Mode Analysis of Common Mode Chokes, Zhe Li, David Pommerenke, and Yoshifumi Shimoshio

PDF

DC Power-Bus Noise Isolation with Power-Plane Segmentation, Wei Cui, Jun Fan, Yong Ren, Hao Shi, James L. Drewniak, and Richard E. DuBroff

PDF

Electromagnetic Compatibility Issues in Mobile Computing, Antonio Orlandi and James L. Drewniak

PDF

FDTD Method Capable of Attaching Rectangular Domains, Kai Xiao, David Pommerenke, and James L. Drewniak

PDF

FDTD Modeling of Isotropic Dispersive Magnetic Materials, Jing Wu, Marina Koledintseva, James L. Drewniak, and David Pommerenke

PDF

Lumped-Circuit Model Extraction for Vias in Multilayer Substrates, Jun Fan, James L. Drewniak, and James L. Knighten

PDF

Memory DIMM DC Power Distribution Analysis and Design, Jingkun Mao, Chen Wang, Giuseppe Selli, Bruce Archambeault, and James L. Drewniak

PDF

Modeling Issues for Full-Wave Numerical EMI Simulation, Michael A. Cracraft, Xiaoning Ye, Chen Wang, Sandeep K. R. Chandra, and James L. Drewniak

PDF

Numerical Modeling of Electrostatic Discharge Generators, Kai Wang, David Pommerenke, Ramachandran Chundru, Thomas Van Doren, James L. Drewniak, and A. Shashindranath

PDF

Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design, Minjia Xu, Todd H. Hubing, Juan Chen, Thomas Van Doren, James L. Drewniak, and Richard E. DuBroff

PDF

Quantifying the Effects on EMI and SI of Source Imbalances in Differential Signaling, Chen Wang and James L. Drewniak

PDF

Reconstruction of the Parameters of Debye and Lorentzian Dispersive Media using a Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, Giulio Antonini, James L. Drewniak, Konstantin Rozanov, and Antonio Orlandi

PDF

SPICE Model Libraries for Via Transitions, Shaofeng Luan, Giuseppe Selli, Jun Fan, Mauro Lai, James L. Knighten, Norman W. Smith, Ray Alexander, Giulio Antonini, Antonio Ciccomancini, Antonio Orlandi, and James L. Drewniak

PDF

Statistical Approach to the EMI Modeling of Large ASICs by a Single Noise-Current Source, Giulio Antonini, James L. Drewniak, Marco Leone, Antonio Orlandi, and Vittorio Ricchiuti

Submissions from 2002

PDF

Alternatives to Gaskets in Shielding an Enclosure, Federico Centola, David Pommerenke, James L. Drewniak, and Xiao Kai

PDF

Anticipating Full Vehicle Radiated EMI from Module-Level Testing in Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, and James L. Drewniak

PDF

Application of Higher-Order FEM Elements to the Analysis of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff

PDF

Efficient Modeling of Discontinuities and Dispersive Media in Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, and S. Celozzi

PDF

Estimating the Noise Mitigation Effect of Local Decoupling in Printed Circuit Boards, Jun Fan, Wei Cui, James L. Drewniak, Thomas Van Doren, and James L. Knighten