Improved Technique for Extracting Parameters of Low-Loss Dielectrics on Printed Circuit Boards

Abstract

The paper is devoted to a methodology and an improved technique of characterization of low-loss dielectrics on printed circuit boards. The technique is based on measuring S-parameters and recalculating them into complex propagation constant. Phase correction is proposed to assure that the phase constant passes through zero at zero frequency. An effect of dielectric loss upon a dielectric constant is considered in the analytical model for dielectric parameter extraction. Dielectric and conductor losses are separated using a model, which includes surface roughness of conductors. Network asymmetry is taken into account in the model. Extracted parameters for frequency-dispersive dielectrics satisfy Kramers-Krönig causality relations. The proposed model allows for extracting dielectric constant and dissipation factor with an increased accuracy.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2009: Aug. 17-21, Austin, TX)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Analytical Model; Conductor Loss; Dielectric Constants; Dielectric Parameter Extraction; Dispersive Dielectrics; Dissipation Factors; Extracting Parameter; Low Loss; Phase Constants; Phase Corrections; Propagation Constant; S-Parameters; Zero Frequency; Dielectric Losses; Electromagnetic Compatibility; Parameter Extraction; Permittivity; Plastic Molds; Printed Circuit Boards; Printed Circuit Manufacture; Scattering Parameters; Surface Roughness; Dielectric Materials

International Standard Book Number (ISBN)

978-1424442676; 978-1424442669

International Standard Serial Number (ISSN)

2158-110X; 2158-1118

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2009

Link to Full Text

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