FDTD Modeling of Absorbing Materials for EMI Applications
Abstract
A few scenarios of applying different magneto-dielectric absorbing sheet materials to mitigate electromagnetic inference (EMI) are analyzed in this paper using a full-wave 3D finite-difference time-domain (FDTD) technique. Frequency characteristics of both permittivity and permeability of these magneto-dielectric materials are approximated by the series of the Debye terms suitable for time-domain simulations. This approximation is accomplished using a new curve fitting technique based on the Legendre polynomials and the regression analysis optimization. The results of the numerical simulations are verified by the corresponding experiments, and the good agreement is obtained.
Recommended Citation
J. Xu et al., "FDTD Modeling of Absorbing Materials for EMI Applications," Proceedings of the Asia-Pacific Symposium on Electromagnetic Compatibility (2010, Beijing, China), pp. 173 - 176, Institute of Electrical and Electronics Engineers (IEEE), Apr 2010.
The definitive version is available at https://doi.org/10.1109/APEMC.2010.5475680
Meeting Name
Asia-Pacific Symposium on Electromagnetic Compatibility (2010: Apr. 12-16, Beijing, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Absorbing Materials; Curve Fitting Technique; Debye Term; FDTD Modeling; Finite Difference Time Domain Technique; Frequency Characteristic; Legendre Polynomials; Numerical Simulation; Sheet Material; Time-Domain Simulations; Computer Simulation; Curve Fitting; Electromagnetic Compatibility; Electromagnetism; Finite Difference Time Domain Method; Magnetic Materials; Magnetos; Paper Sheeting; Regression Analysis; Dielectric Materials
International Standard Book Number (ISBN)
978-1424456215; 978-1424456239
International Standard Serial Number (ISSN)
2162-7673
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Apr 2010