Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2013

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SE Measurements with a TEM Cell to Study Gasket Reliability, Parisa Faraji, James L. Drewniak, Douglas S. McBain, and David Pommerenke

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Sheet Absorbing Material Modeling and Application for Enclosures, Andriy Radchenko, Joseph A. Bishop, Richard Johnson, Paul Dixon, Marina Koledintseva, Roman G. Jobava, David Pommerenke, and James L. Drewniak

Statistical BER Analysis due to Supply Voltage Fluctuations at a Single-Ended Buffer, Jingook Kim, Dongil Shin, Junho Lee, Sunki Cho, Chulsoon Hwang, and Jun Fan

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The Application of Spark Gaps on Audio Jack for ESD Protection, Jing Li, Jun Fan, and David Pommerenke

Submissions from 2012

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A Hierarchy of Explicit Low-Dispersion FDTD Methods for Electrically Large Problems, William S. Smith, Alexander G. Razmadze, Xuanmin Shao, and James L. Drewniak

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A Hybrid Stack-Up of Printed Circuit Board for High-Speed Networking Systems, Jianmin Zhang, Antonio Ciccomancini Scogna, Jun Fan, Bruce Archambeault, James L. Drewniak, and Antonio Orlandi

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Analysis and Mitigation Techniques for Broadband EMI from Synchronous Buck Converter, Keong Kam, David Pommerenke, Ankit Bhargava, Cheungwei Lam, Robert J. Steinfeld, and Federico Centola

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An Application of Utilizing the System-Efficient-ESD-Design (SEED) Concept to Analyze an LED Protection Circuit of a Cell Phone, Tianqi Li, Junji Maeshima, Hideki Shumiya, David Pommerenke, Takashi Yamada, and Kenji Araki

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A Novel Method for ESD Soft Error Analysis on Integrated Circuits using a TEM Cell, Jongsung Lee, Jaedeok Lim, Byongsu Seol, Zhen Li, and David Pommerenke

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A Practical Approach to Analyze Copper Surface Roughness Effects with Applications to Stripline Structures, Xichen Guo, Ji Chen, David R. Jackson, Marina Koledintseva, James L. Drewniak, and Christopher Pan

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Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network, Jingook Kim, Liang Li, Songping Wu, Hanfeng Wang, Yuzo Takita, Hayato Takeuchi, Kenji Araki, Jun Fan, and James L. Drewniak

Determination of Copper Foil Surface Roughness from Micro-Section Photographs, Scott Hinaga, Soumya De, Aleksandr Yakubovich Gafarov, Marina Koledintseva, and James L. Drewniak

Development of Driving Cycle for Hybrid Electric Tactical Wheeled Vehicle, Seungtaek Jeong, J. Kim, Y. Lee, and DongHyun Kim

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Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards, Amendra Koul, Marina Koledintseva, Scott Hinaga, and James L. Drewniak

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EMI Reduction Evaluation with Flexible Absorbing Materials and Ferrite Cores Applied on Cables, Jing Li, Yaojiang Zhang, Aleksandr Yakubovich Gafarov, Soumya De, Marina Koledintseva, Joel Marchand, David Hess, Todd Durant, Eric Nickerson, James L. Drewniak, and Jun Fan

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Estimate on the Uncertainty of Predicting Radiated Emission from Near-Field Scan Caused by Insufficient or Inaccurate Near-Field Data: Evaluation of the Needed Step Size, Phase Accuracy and the Need for All Surfaces in the Huygens' Box, Morten Sørensen, Ondrej Franek, Gert Frølund Pedersen, Andriy Radchenko, Keong Kam, and David Pommerenke

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Evaluation of Absorptive Properties and Permeability of Thin Sheet Magneto-Dielectric Materials, Marina Koledintseva, Victor Khilkevich, Alexander G. Razmadze, Aleksandr Yakubovich Gafarov, Soumya De, and James L. Drewniak

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From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics-Part II: Random Cylindrical Inclusions, Muhammet Hilmi Nisanci, Francesco de Paulis, Marina Koledintseva, James L. Drewniak, and Antonio Orlandi

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Homogenized Permittivity of Composites with Aligned Cylindrical Inclusions for Causal Electromagnetic Simulations, Francesco de Paulis, Muhammet Hilmi Nisanci, Marina Koledintseva, James L. Drewniak, and Antonio Orlandi

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Modeling Broadside Coupled Traces using Equivalent Per Unit Length (eq PUL) RLGC Model, Arun Reddy Chada, Songping Wu, Jun Fan, James L. Drewniak, Bhyrav Mutnury, and Daniel N. de Araujo

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Model of Secondary ESD for a Portable Electronic Product, Jiang Xiao, David Pommerenke, James L. Drewniak, Hideki Shumiya, Junji Maeshima, Takashi Yamada, and Kenji Araki

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Numerical Evaluation of Near-Field to Far-Field Transformation Robustness for EMC, Andriy Radchenko, Ji Zhang, Keong Kam, and David Pommerenke

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On Different Methods to Combine Cable Information into Near-Field Data for Far-Field Estimation, Keong Kam, Andriy Radchenko, and David Pommerenke

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PCB Conductor Surface Roughness as a Layer with Effective Material Parameters, Marina Koledintseva, Alexander G. Razmadze, Aleksandr Yakubovich Gafarov, Soumya De, James L. Drewniak, and Scott Hinaga

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Permeability and Permittivity Uncertainty Effects in Modeling Absorbing Coatings and Ferrites on Cables, Jing Li, Marina Koledintseva, Alexander G. Razmadze, Aleksandr Yakubovich Gafarov, Yaojiang Zhang, James L. Drewniak, Jun Fan, and Jing Shenhui

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Prediction of Common-Mode Current Reduction using Ferrites in Systems with Cable Harnesses, Natalia G. Bondarenko, Peng Shao, Andrea Orlando, Marina Koledintseva, Daryl G. Beetner, and Phil Berger

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Semi-Automatic Copper Foil Surface Roughness Detection from PCB Microsection Images, Soumya De, Aleksandr Yakubovich Gafarov, Marina Koledintseva, R. Joe Stanley, James L. Drewniak, and Scott Hinaga

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Signal Integrity: Efficient, Physics-Based Via Modeling: Integration of Striplines, Renato Rimolo-Donadio; Giuseppe Selli; Francesco, de Paulis; Xiaoxiong Gu; Young Hoon Kwark; James L. Drewniak; H. D. Bruens; and Christian Schuster

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Simulation of Automotive EMC Emission Test Procedures Based on Cable Bundle Measurements, Markus Gonser, Christoph Keller, Jan Hansen, Victor Khilkevich, Andriy Radchenko, David Pommerenke, and Robert Weigel

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Switching-Current Measurement for Multiple ICs Sharing a Common Power Island Structure, Liang Li, Chulsoon Hwang, Tao Wang, Yuzo Takita, Hayato Takeuchi, Kenji Araki, and Jun Fan

Submissions from 2011

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20V-High Speed Low Cost Arbitrary Waveform Generator for ICs Immunity Test, Xu Gao, Tianqi Li, Nicholas Bennett Mentesana, Zhenwei Yu, Aleksandr Yakubovich Gafarov, Liehui Ren, Hongyu An, and David Pommerenke

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A Combined Impedance Measurement Method for ESD Generator Modeling, Friedrich zur Nieden, Stephan Frei, and David Pommerenke

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Analytical Expressions for Transfer Function of Supply Voltage Fluctuation to Jitter at a Single-Ended Buffer, Jingook Kim, Soumya De, Ketan Shringarpure, Siming Pan, Brice Achkir, Jun Fan, and James L. Drewniak

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An Evaluation of TVS Devices for ESD Protection, Ramachandran Chundru, Zhen Li, David Pommerenke, Keong Kam, Cheungwei Lam, Federico Centola, and Robert J. Steinfeld

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A Study of a Measurement and Simulation Method on ESD Noise Causing Soft-Errors by Disturbing Signals, Jongsung Lee, Jaedeok Lim, Cheolgu Jo, Byongsu Seol, Argha Nandy, Tianqi Li, and David Pommerenke

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bModel of Secondary ESD for a Portable Product, Jiang Xiao, David Pommerenke, James L. Drewniak, Hideki Shumiya, Takashi Yamada, and Kenji Araki

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Corrections to "Full Wave Simulation of an Electrostatic Discharge Generator Discharging in Air Discharge Mode Into a Product", Jiang Xiao, Dazhao Liu, and David Pommerenke

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DC-DC buck converter EMI reduction using PCB layout modification, Ankit Bhargava, David Pommerenke, Keong Kam, Federico Centola, and Cheungwei Lam

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Differential and Extrapolation Techniques for Extracting Dielectric Loss of Printed Circuit Board Laminates, Marina Koledintseva, Amendra Koul, Scott Hinaga, and James L. Drewniak

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Effect of Anisotropy on Extracted Dielectric Properties of PCB Laminate Dielectrics, Marina Koledintseva, James L. Drewniak, and Scott Hinaga

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Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs with Via Arrays, Jingook Kim, Ketan Shringarpure, Jun Fan, Joungho Kim, and James L. Drewniak

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From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions, Francesco de Paulis, Muhammet Hilmi Nisanci, Marina Koledintseva, James L. Drewniak, and Antonio Orlandi

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Full-Wave Simulation of an Electrostatic Discharge Generator Discharging in Air-Discharge Mode into a Product, Dazhao Liu, Argha Nandy, Fan Zhou, Wei Huang, Jiang Xiao, Byongsu Seol, Jongsung Lee, Jun Fan, and David Pommerenke

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Inductance Calculations for Plane-Pair Area Fills with Vias in a Power Distribution Network using a Cavity Model and Partial Inductances, Jingook Kim, Jun Fan, Albert E. Ruehli, Joungho Kim, and James L. Drewniak

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Modelling Electromagnetic Field Coupling from an ESD Gun to an IC, Ji Zhang, Daryl G. Beetner, Richard Moseley, Scott Herrin, and David Pommerenke

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On the Possibility to Detect and Visualize Electromagnetic Coupling Paths, Hongyu Li, Victor Khilkevich, David Pommerenke, Yaojiang Zhang, and Jun Fan

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Quantification of Self-Damping of Power MOSFET in a Synchronous Buck Converter, Keong Kam, David Pommerenke, Ankit Bhargava, Robert J. Steinfeld, Cheungwei Lam, and Federico Centola

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Software-Based Analysis of the Effects of Electrostatic Discharge on Embedded Systems, Pratik Rajesh Maheshwari, Tianqi Li, Jongsung Lee, Byongsu Seol, Sahra Sedigh, and David Pommerenke

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Systematic Analysis and Engineering of Absorbing Materials Containing Magnetic Inclusions for EMC Applications, Marina Koledintseva, Jianfeng Xu, Soumya De, James L. Drewniak, Yongxue He, and Richard Johnson

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The Evaluation Method for ESD Immunity of Components in Terms of Soft Error, Jaedeok Lim, Jongsung Lee, Byongsu Seol, Argha Nandy, and David Pommerenke