Extraction of Equivalent Inductance in Package-PCB Hierarchical Power Distribution Network
Abstract
A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies.
Recommended Citation
J. Kim et al., "Extraction of Equivalent Inductance in Package-PCB Hierarchical Power Distribution Network," Proceedings of the 18th Conference on Electrical Performance of Electronic Packaging and Systems (2009, Portland, OR), pp. 109 - 112, Institute of Electrical and Electronics Engineers (IEEE), Oct 2009.
The definitive version is available at https://doi.org/10.1109/EPEPS.2009.5338464
Meeting Name
18th Conference on Electrical Performance of Electronic Packaging and Systems (2009: Oct. 19-21, Portland, OR)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Cavity Resonant Frequencies; Equivalent Inductance; Multiple Vias; Power Bus; Power Distribution Network; Distributed Parameter Networks; Inductance; Natural Frequencies; Polychlorinated Biphenyls; Electronics Packaging
International Standard Book Number (ISBN)
978-1424444472
International Standard Serial Number (ISSN)
2165-4107; 2165-4115
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Oct 2009
