Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2006

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Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements, Vijay Kasturi, Shaowei Deng, Todd H. Hubing, and Daryl G. Beetner

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Signal Link-Path Characterization Up to 20 GHz Based on a Stripline Structure, Jianmin Zhang, James L. Drewniak, David Pommerenke, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John C. Fisher, and Sergio Camerlo

Submissions from 2005

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A Hybrid Approach to Decrease Port Influence in Transmission Line Characterization, Jianmin Zhang, David Pommerenke, James L. Drewniak, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John Fisher, and Sergio Camerlo

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A Three-Dimensional FDTD Subgridding Method with Separate Spatial and Temporal Subgridding Interfaces, Kai Xiao, David Pommerenke, and James L. Drewniak

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Complex Power Distribution Network Investigation using SPICE Based Extraction from First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean McCoy, Bruce Archambeault, Stefano Grivet-Talocia, and Flavio G. Canavero

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Coupling Between Differential Signals and the DC Power-Bus in Multilayer PCBs, Chen Wang, Marco Leone, James L. Drewniak, and Antonio Orlandi

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Engineering of Composite Media for Shields at Microwave Frequencies, Marina Koledintseva, Poorna Chander Ravva, Richard E. DuBroff, James L. Drewniak, Konstantin Rozanov, and Bruce Archambeault

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Neural Network Detection and Identification of Electronic Devices based on their Unintended Emissions, Haixiao Weng, Xiaopeng Dong, Xiao Hu, Daryl G. Beetner, Todd H. Hubing, and Donald C. Wunsch

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Power Integrity Investigation of BGA Footprints by Means of the Segmentation Method, Giuseppe Selli, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean McCoy, and Bruce Archambeault

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Validation of Circuit Extraction Procedure by Means of Frequency and Time Domain Measurement, Giulio Antonini, Antonio Ciccomancini Scogna, Antonio Orlandi, Vittorio Ricchiuti, Giuseppe Selli, Shaofeng Luan, and James L. Drewniak

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Wide-Band Lorentzian Media in the FDTD Algorithm, Marina Koledintseva, James L. Drewniak, David Pommerenke, Giulio Antonini, Antonio Orlandi, and Konstantin Rozanov

Submissions from 2004

3D Modeling and Circuit Model Extraction of Vias in Multilayer Printed Circuit Boards, Giuseppe Selli, Jianmin Zhang, Mauro Lai, Andrea de Luca, Antonio Ciccomancini, Bruce Archambeault, Giulio Antonini, James L. Drewniak, Antonio Orlandi, Jun Fan, and James L. Knighten

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A Circuit Approach to Model Narrow Slot Structures in a Power Bus, Lin Zhang, Ray Alexander, Richard E. DuBroff, James L. Drewniak, James L. Knighten, Norman W. Smith, Bruce Archambeault, Samuel R. Connor, and Jun Fan

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An Extrapolation Procedure to Shorten Time Domain Simulations, Giuseppe Selli, James L. Drewniak, and David Pommerenke

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Anticipating EMI and On-Board Interference in Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, and Chingchi Chen

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A Three-Dimensional FDTD Subgridding Algorithm Based on Interpolation of Current Density, Kai Xiao, David Pommerenke, and James L. Drewniak

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A Time Domain Approach to Estimate Current Draw from SMT Decoupling Capacitors, Lin Zhang, Bruce Archambeault, Samuel Conner, James L. Knighten, Jun Fan, Norman W. Smith, Ray Alexander, Richard E. DuBroff, and James L. Drewniak

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Common-Mode Current Due to a Trace Near a PCB Edge and its Suppression by a Guard Band, Yoshiki Kayano, Motoshi Tanaka, James L. Drewniak, and Hiroshi Inoue

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Comparison of Via Equivalent Circuit Model Accuracy using Quasi-Static and Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, and Albert E. Ruehli

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Effects of Open Stubs Associated with Plated Through-Hole Vias in Backpanel Designs, Shaowei Deng, Jingkun Mao, Todd H. Hubing, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, and Chen Wang

Efficient Capacitance Calculations for PEEC Circuit Analysis, Jingkun Mao, Giulio Antonini, Antonio Orlandi, and James L. Drewniak

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Electrical Material Property Measurements using a Free-Field, Ultra-Wideband System [Dielectric Measurements], C. A. Grosvenor, R. Johnk, D. Novotny, S. Canales, J. Baker-Jarvis, M. Janezic, James L. Drewniak, Marina Koledintseva, Jianmin Zhang, and Poorna Chander Ravva

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Electromagnetic Interference (EMI) of System-on-Package (SOP), Toshio Sudo, Hideki Sasaki, Norio Masuda, and James L. Drewniak

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Expert System Algorithms for Identifying Radiated Emission Problems in Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. DuBroff, James L. Drewniak, David Pommerenke, and R. Kaires

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Extracting R, L, G, C Parameters of Dispersive Planar Transmission Lines from Measured S-Parameters using a Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, Giulio Antonini, Antonio Orlandi, and Konstantin Rozanov

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Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling, Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea de Luca, Giulio Antonini, Antonio Orlandi, Antonio Ciccomancini Scogna, Jun Fan, James L. Knighten, Norman W. Smith, and Ray Alexander

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Extraction of SPICE-Type Equivalent Circuits of Signal Via Transitions using the PEEC Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, and Antonio Orlandi

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Representation of Permittivity for Multiphase Dielectric Mixtures in FDTD Modeling, Marina Koledintseva, J. Wu, H. Zhang, James L. Drewniak, and Konstantin Rozanov

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Static and Quasi-Dynamic Load Balancing in Parallel FDTD Codes for Signal Integrity, Power Integrity, and Packaging Applications, Sarah A. Seguin, Michael A. Cracraft, and James L. Drewniak

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Susceptibility Characterization of a Cavity with an Aperture by using Slowly Rotating EM Fields: FDTD Analysis and Measurements, Kimitoshi Murano, Takeshi Sanpei, Fengchao Xiao, Chen Wang, Yoshio Kami, and James L. Drewniak

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The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained From Numerical Modeling, Shaofeng Luan, Jun Fan, James L. Knighten, and Norman W. Smith

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Validation of Equivalent Circuits Extracted from S-Parameter Data for Eye-pattern Evaluation, Giuseppe Selli, Mauro Lai, Shaofeng Luan, James L. Drewniak, Richard E. DuBroff, Jun Fan, James L. Knighten, Norman W. Smith, Giulio Antonini, Antonio Orlandi, Bruce Archambeault, and Samuel R. Connor

Submissions from 2003

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A Dual-current Method for Characterizing Common-Mode Loop Impedance, Geping Liu, Yimin Ding, Chingchi Chen, Richard W. Kautz, James L. Drewniak, David Pommerenke, and Marina Koledintseva

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Anticipating EMI using Transfer Functions and Signal Integrity Information, Chen Wang, James L. Drewniak, and Jim Nadolny

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Anticipating Vehicle-Level EMI using a Multi-Step Approach, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, and Chingchi Chen

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Common-Mode and Differential-Mode Analysis of Common Mode Chokes, Zhe Li, David Pommerenke, and Yoshifumi Shimoshio

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DC Power-Bus Noise Isolation with Power-Plane Segmentation, Wei Cui, Jun Fan, Yong Ren, Hao Shi, James L. Drewniak, and Richard E. DuBroff

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Electromagnetic Compatibility Issues in Mobile Computing, Antonio Orlandi and James L. Drewniak

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FDTD Method Capable of Attaching Rectangular Domains, Kai Xiao, David Pommerenke, and James L. Drewniak

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FDTD Modeling of Isotropic Dispersive Magnetic Materials, Jing Wu, Marina Koledintseva, James L. Drewniak, and David Pommerenke

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Lumped-Circuit Model Extraction for Vias in Multilayer Substrates, Jun Fan, James L. Drewniak, and James L. Knighten

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Memory DIMM DC Power Distribution Analysis and Design, Jingkun Mao, Chen Wang, Giuseppe Selli, Bruce Archambeault, and James L. Drewniak

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Modeling Issues for Full-Wave Numerical EMI Simulation, Michael A. Cracraft, Xiaoning Ye, Chen Wang, Sandeep K. R. Chandra, and James L. Drewniak

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Numerical Modeling of Electrostatic Discharge Generators, Kai Wang, David Pommerenke, Ramachandran Chundru, Thomas Van Doren, James L. Drewniak, and A. Shashindranath

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Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design, Minjia Xu, Todd H. Hubing, Juan Chen, Thomas Van Doren, James L. Drewniak, and Richard E. DuBroff

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Quantifying the Effects on EMI and SI of Source Imbalances in Differential Signaling, Chen Wang and James L. Drewniak

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Reconstruction of the Parameters of Debye and Lorentzian Dispersive Media using a Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, Giulio Antonini, James L. Drewniak, Konstantin Rozanov, and Antonio Orlandi

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SPICE Model Libraries for Via Transitions, Shaofeng Luan, Giuseppe Selli, Jun Fan, Mauro Lai, James L. Knighten, Norman W. Smith, Ray Alexander, Giulio Antonini, Antonio Ciccomancini, Antonio Orlandi, and James L. Drewniak

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Statistical Approach to the EMI Modeling of Large ASICs by a Single Noise-Current Source, Giulio Antonini, James L. Drewniak, Marco Leone, Antonio Orlandi, and Vittorio Ricchiuti

Submissions from 2002

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Alternatives to Gaskets in Shielding an Enclosure, Federico Centola, David Pommerenke, James L. Drewniak, and Xiao Kai