Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2002

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External Parasitic Inductance in Microstrip and Stripline Geometries of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, and David M. Hockanson

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Eye Pattern Evaluation in High-Speed Digital Systems Analysis by using MTL Modeling, Giulio Antonini, James L. Drewniak, Antonio Orlandi, and Vittorio Ricchiuti

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FDTD Analysis of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, and James L. Drewniak

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FDTD Modeling Incorporating a Two-Port Network for I/O Line EMI Filtering Design, Xiaoning Ye and James L. Drewniak

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FDTD Modeling of Skin Effect, Chen Wang, James L. Drewniak, Min Li, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, and Jingyu Huang

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Field Extraction from Near Field Scanning for a Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. DuBroff, James L. Drewniak, David Pommerenke, and Todd H. Hubing

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High-Performance Inter-PCB Connectors: Analysis of EMI Characteristics, Xiaoning Ye, James L. Drewniak, Jim Nadolny, and David M. Hockanson

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Modeling Noise Coupling from Non-Parallel PCB Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, and Richard E. DuBroff

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Transmission Line Modeling of Vias in Differential Signals, Chen Wang, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, and Ray Alexander

Submissions from 2001

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An EMI Estimate for Shielding-Enclosure Evaluation, Min Li, James L. Drewniak, S. Radu, Joe Nuebel, Todd H. Hubing, Richard E. DuBroff, and Thomas Van Doren

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DC Power-Bus Design using FDTD Modeling with Dispersive Media and Surface Mount Technology Components, Xiaoning Ye, Marina Koledintseva, Min Li, and James L. Drewniak

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DC Power-Bus Modeling and Design with a Mixed-Potential Integral-Equation Formulation and Circuit Extraction, Jun Fan, James L. Drewniak, Hao Shi, and James L. Knighten

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DC Power Bus Noise Isolation with Power Islands, Wei Cui, Jun Fan, Hao Shi, and James L. Drewniak

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Differential Signalling in PCBs: Modeling and Validation of Dielectric Losses and Effects of Discontinuities, R. Araneo, Chen Wang, Xiaoxiong Gu, S. Celozzi, and James L. Drewniak

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EMI Considerations in Selecting Heat-Sink-Thermal-Gasket Materials, Yu Huang, J. E. Butler, M. de Sorgo, Richard E. DuBroff, Todd H. Hubing, James L. Drewniak, and Thomas Van Doren

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EMI Mitigation with Multilayer Power-Bus Stacks and Via Stitching of Reference Planes, Xiaoning Ye, David M. Hockanson, Min Li, Yong Ren, Wei Cui, James L. Drewniak, and Richard E. DuBroff

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FDTD and Experimental Investigation of EMI from Stacked-Card PCB Configurations, David M. Hockanson, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, and Richard E. DuBroff

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Grounding of Heatpipe/Heatspreader and Heatsink Structures for EMI Mitigation, Chen Wang, James L. Drewniak, D. Wang, Ray Alexander, James L. Knighten, and David M. Hockanson

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Improving the High-Frequency Attenuation of Shunt Capacitor, Low-Pass Filters, Christopher N. Olsen, Thomas Van Doren, Todd H. Hubing, James L. Drewniak, and Richard E. DuBroff

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Including SMT Ferrite Beads in DC Power Bus and High-Speed I/O Line Modeling, Jun Fan, Shaofeng Luan, and James L. Drewniak

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Incorporating Two-Port Networks with S-Parameters into FDTD, Xiaoning Ye and James L. Drewniak

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Investigation of PCB Layout Parasitics in EMI Filtering of I/O Lines, Xiaoning Ye, Geping Liu, and James L. Drewniak

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Mitigating Power Bus Noise with Embedded Capacitance in PCB Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff

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Modeling DC Power-Bus Structures with Vertical Discontinuities using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation, Jun Fan, Hao Shi, Antonio Orlandi, James L. Knighten, and James L. Drewniak

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Modeling Shared-Via Decoupling in a Multi-Layer Structure Using the CEMPIE Approach, Wei Cui, Jun Fan, Shaofeng Luan, and James L. Drewniak

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Quantifying SMT Decoupling Capacitor Placement in dc Power-Bus Design for Multilayer PCBs, Jun Fan, James L. Drewniak, James L. Knighten, Norman W. Smith, Antonio Orlandi, Thomas Van Doren, Todd H. Hubing, and Richard E. DuBroff

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Representation of Gyromagnetic Composite Media for FDTD Modeling, Marina Koledintseva, James L. Drewniak, and Xiaoning Ye

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The Effects of Via Transitions on Differential Signals, Chen Wang, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, and James L. Drewniak

Submissions from 2000

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A Common-Mode Current Measurement Technique for EMI Performance Evaluation of PCB Structures, Xiaoning Ye, David M. Hockanson, and James L. Drewniak

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DC Power Bus Design with FDTD Modeling Including a Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, and James L. Drewniak

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DC Power Bus Modeling in High-Speed Digital Designs Including Conductor and Dielectric Losses, Jun Fan, Hao Shi, James L. Knighten, and James L. Drewniak

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DC Power Bus Modeling using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation and an Iterative Equation Solver, Jun Fan, James L. Drewniak, and James L. Knighten

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Development of a Closed-Form Expression for the Input Impedance of Power-ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, and James L. Drewniak

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EMC Analysis of an 18" LCD Monitor, Theodore M. Zeeff, Todd H. Hubing, James L. Drewniak, Richard E. DuBroff, and Thomas Van Doren

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EMI from Airflow Aperture Arrays in Shielding Enclosures-Experiments, FDTD, and MoM Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. DuBroff, Todd H. Hubing, and Thomas Van Doren

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EMI from Cavity Modes of Shielding Enclosures-FDTD Modeling and Measurements, Min Li, Joe Nuebel, James L. Drewniak, Richard E. DuBroff, Todd H. Hubing, and Thomas Van Doren

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EMI Reduction from Airflow Aperture Arrays using Dual-Perforated Screens and Loss, Min Li, Joe Nuebel, James L. Drewniak, Todd H. Hubing, Richard E. DuBroff, and Thomas Van Doren

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EMI Resulting from a Signal Via Transition Through DC Power Bus-Effectiveness of Focal SMT Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, and James L. Drewniak

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EMI Resulting from Signal Via Transitions through the DC Power Bus, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, and James L. Drewniak

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Experimental and FDTD Study of the EMI Performance of an Open-Pin-Field Connector for Modules-on-Backplanes, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Richard E. DuBroff, Thomas Van Doren, and Todd H. Hubing

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Experimental and Numerical Study of the Radiation from Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff

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Experimental Evaluation of Power Bus Decoupling on a 4-Layer Printed Circuit Board, Juan Chen, Minjia Xu, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, and Richard E. DuBroff

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FDTD and FEM/MOM Modeling of EMI Resulting from a Trace Near a PCB Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. DuBroff, and Thomas Van Doren

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FDTD Modeling of Lumped Ferrites, Min Li, Xiao Luo, and James L. Drewniak

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Finite Element Modeling of Patch Antenna and Cavity Sources, Yun Ji, Todd H. Hubing, and James L. Drewniak

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Modeling EMI Resulting from a Signal Via Transition Through Power/Ground Layers, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, and James L. Drewniak

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Quantifying Decoupling Capacitor Location, Jun Fan, James L. Knighten, Antonio Orlandi, Norman W. Smith, and James L. Drewniak

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The EMI Benefits of Ground Plane Stitching in Multi-Layer Power Bus Stacks, Xiaoning Ye, David M. Hockanson, Min Li, Wei Cui, S. Radu, James L. Drewniak, Thomas Van Doren, Todd H. Hubing, and Richard E. DuBroff

Submissions from 1999

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Anticipating EMI from Coupling Between High-Speed Digital and I/O Lines, Wei Cui, Min Li, Xiao Luo, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, and Richard E. DuBroff

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Application of a Hybrid FEM/MOM Method to a Canonical PCB Problem, Yun Ji, J. Chen, Todd H. Hubing, and James L. Drewniak