EMI Mitigation with Lossy Material at 10 GHz
Abstract
In this paper, absorber material is utilized to mitigate an EMI problem in real hardware. For a complex and large system, identification of the source location is the first problem which must be solved to achieve electromagnetic interference (EMI) mitigation. Emission Source Microscopy (ESM) provides a powerful tool for locating the sources of radiation in GHz range on a printed circuit board (PCB). Once the source is identified, a suitable volume of the absorber material is placed on the source location to effectively reduce the radiated power at the frequency of interest. Further measurements of the total radiated power in a reverberation chamber are also performed to validate the EMI reduction method with the absorber material.
Recommended Citation
X. Jiao and P. Maheshwari and V. Khilkevich and P. Dixon and Y. Ariën and A. U. Bhobe and J. Li and X. Li and D. Pommerenke and J. L. Drewniak and H. Kajbaf and J. Min, "EMI Mitigation with Lossy Material at 10 GHz," Proceedings of the 2014 IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC), vol. 2014-September, no. September, pp. 150 - 154, Institute of Electrical and Electronics Engineers (IEEE), Sep 2014.
The definitive version is available at https://doi.org/10.1109/ISEMC.2014.6898960
Meeting Name
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 3-8, Raleigh, NC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic compatibility; Electromagnetic pulse; Interference suppression; Location; Printed circuits; Reverberation; Absorber material; Electromagnetic interference (EMI) mitigations; EMI; Emission sources; Printed circuit boards (PCB); Reverberation chambers; Source localization; Total radiated power; Printed circuit boards
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Sep 2014