"Analysis of Wireless Power Transfer system design on active silicon in" by Jinwook Song, Sukjin Kim et al.
 

Analysis of Wireless Power Transfer system design on active silicon interposer for low voltage applications in 3D-IC

Abstract

In this study, a Wireless Power Transfer (WPT) system design on active silicon (Si) interposer for low voltage applications in 3D-IC is proposed. The proposed WPT system includes magnetically coupled coils, a full-bridge rectifier, and a voltage regulator. In order to validate the proposed system, we first design all of the system components. First, we design a three dimensional helix-type transmitter (Tx) coil with the size of 1.6 mm by 1.6 mm on PCB, and a spiral-type receiver (Rx) coil using 3 μm top metal CMOS process with the size of 1.5 mm by 1.5 mm on Si-interposer. Second, a CMOS full-bridge rectifier is designed on the active Si-interposer to convert the AC voltage received from the Tx coil to DC voltage, which will then be fed to the input of the voltage regulator. Third, we design a voltage regulator to deliver 1.5 V DC voltage supply to multiple low voltage devices in 3D-IC. Power transfer efficiency of the coil system, full-bridge rectifier including a filtering capacitor, and voltage regulator is calculated to be 55 %, 69.5 %, and 71 %, respectively from circuit simulations. The simulated whole system efficiency is found to be 27 %.

Meeting Name

23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 (2014: Oct. 26-29, Portland, OR)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Wireless Power Transfer; Magnetic Coupling; Active Silicon Interposer; Voltage Regulator; Full-Bridge Rectifier; CMOS Process; Time Domain Analysis; Power Transfer Efficiency

International Standard Book Number (ISBN)

978-1-4799-3641-0; 978-1-4799-3643-4

International Standard Serial Number (ISSN)

2165-4107; 2165-4115

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2014

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