De-Embedding Method to Accurately Measure High-Frequency Impedance of an O-Shape Spring Contact

Abstract

In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.

Meeting Name

2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 4-8, Raleigh, NC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Second Research Center/Lab

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Electric impedance; Conductor loss; Current flows; De-embedding method; Full-wave simulations; High frequency HF; High frequency impedance; Impedance profiles; Simulation model; Electromagnetic compatibility; O-Clip

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

08 Aug 2014

Link to Full Text

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