Abstract
DC power-bus modeling in high-speed digital design using the FDTD method is reported here. The dispersive medium is approximated by a Debye model to account for the loss. A wide band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Favorable agreement is achieved between the modeled and measured results for a typical DC power-bus structure with multiple SMT decoupling capacitors mounted on the board. The FDTD tool is then applied to investigate the effects of local decoupling on a DC power-bus. The modeled results agree with the results from another modeling tool, the CEMPIE (a circuit extraction approach based on a mixed-potential integral equation formulation) method.
Recommended Citation
X. Ye et al., "DC Power Bus Design with FDTD Modeling Including a Dispersive Media," Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (2000, Scottsdale, AZ), pp. 55 - 58, Institute of Electrical and Electronics Engineers (IEEE), Oct 2000.
The definitive version is available at https://doi.org/10.1109/EPEP.2000.895492
Meeting Name
IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (2000: Oct. 23-25, Scottsdale, AZ)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Approximation Theory; Capacitors; Computer Simulation; Finite Difference Method; Multilayers; Semiconductor Device Models; Surface Mount Technology; Time Domain Analysis; Debye Models; Direct Current Power Bus Designs; Printed Circuit Boards; Finite Difference Methods; Dispersion; Capacitors; Noise Reduction; Resonant Frequency; Testing; Coaxial Cables; Electromagnetic Compatibility; Integral Equations; Finite Difference Time-Domain Analysis; Dispersive Media; Frequency Response; Printed Circuit Design; Power Supply Circuits; Digital Circuits
International Standard Book Number (ISBN)
780364503
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Oct 2000