EMI Resulting from Signal Via Transitions through the DC Power Bus
Abstract
Signal routing with layer changes through via transitions are common in multi-layer printed circuit board (PCB) design. For high-speed signals that transition through the internal parallel planes comprising the DC power bus, the return current has to switch from one reference plane to another reference plane. The return current discontinuity at the via excites the DC power bus and can result in a power bus noise problem, as well as an EMI problem. EMI resulting from the signal transitions through a DC power bus is studied herein. Measurements were made on an experimental board, and numerical modeling was used to study the EMI resulting from the excited DC power bus. The effects of local and global decoupling as an EMI mitigation approach were also studied. In addition, noise coupled to I/O lines, and EMI were studied for a test board with varying layer thickness between the power and ground planes.
Recommended Citation
W. Cui et al., "EMI Resulting from Signal Via Transitions through the DC Power Bus," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2000, Washington, D.C.), vol. 2, pp. 821 - 826, Institute of Electrical and Electronics Engineers (IEEE), Aug 2000.
The definitive version is available at https://doi.org/10.1109/ISEMC.2000.874728
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2000: Aug. 21-25, Washington, DC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic Wave Interference; Mathematical Models; Numerical Analysis; Routers; Spurious Signal Noise; DC Power Bus; Printed Circuit Boards
International Standard Book Number (ISBN)
780356772
International Standard Serial Number (ISSN)
0190-1494
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2000