Abstract
Power bus design is a critical aspect in high-speed digital circuit designs. A circuit extraction approach based on a mixed-potential integral equation formulation is presented herein to model arbitrary multilayer power bus structures including vertical discontinuities associated with surface mount (SMT) decoupling capacitor interconnects. Both conductor and dielectric losses are incorporated, and included into the first principles formulation. The agreement of modeling and measurements demonstrates its effectiveness and utilization in power bus designs.
Recommended Citation
J. Fan et al., "DC Power Bus Modeling in High-Speed Digital Designs Including Conductor and Dielectric Losses," Proceedings of the 2nd Asia-Pacific Conference on Environmental Electromagnetics (2000, Shanghai, China), pp. 126 - 131, Institute of Electrical and Electronics Engineers (IEEE), May 2000.
The definitive version is available at https://doi.org/10.1109/CEEM.2000.853915
Meeting Name
2nd Asia-Pacific Conference on Environmental Electromagnetics (2000: May 3-7, Shanghai, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
DC Power Bus Modeling; Arbitrary Multilayer Power Bus Structures; Circuit Extraction Approach; Conductor Losses; Conductors (Electric); Dielectric Losses; Digital Integrated Circuits; High-Speed Digital Circuit; High-Speed Digital Designs; High-Speed Integrated Circuits; Integral Equations; Integrated Circuit Design; Mixed-Potential Integral Equation Formulation; Surface Mount Decoupling Capacitor Interconnects; Surface Mount Technology; Vertical Discontinuities; Buses; Design; Dielectric Devices; Integrated Circuit Manufacture; Reconfigurable Hardware; Arbitrary Multilayers; Circuit Extraction; Decoupling Capacitor; High Speed Digital Design; Mixed Potential Integral Equations; Modeling And Measurement; Power-Bus Structure
International Standard Book Number (ISBN)
978-7563504206
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2000