Abstract
The data rates and clock speeds of current highspeed signals are increasing rapidly, consequently, not only the lossy nature of FR-4 but also the lossy nature of good conductors, such as copper, need to be taken into account in high-speed signal designs. In order to well predict the loss caused by both dielectric loss and skin effect loss, a suitable simulation tool is needed. A surface impedance boundary condition (SIBC) algorithm was implemented in FDTD modeling herein to accommodate the skin effect loss due to finite conductivity of good conductors. Good agreement between the FDTD result and the measurements as well as SPICE result was obtained for a 14 mils wide strip line.
Recommended Citation
C. Wang et al., "FDTD Modeling of Skin Effect," Proceedings of the 3rd International Symposium on Electromagnetic Compatibility (2002, Beijing, China), pp. 246 - 249, Institute of Electrical and Electronics Engineers (IEEE), May 2002.
The definitive version is available at https://doi.org/10.1109/ELMAGC.2002.1177417
Meeting Name
3rd International Symposium on Electromagnetic Compatibility (2002: May 21-24, Beijing, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
14 Mil; Cu; FDTD Modeling; Conductors; Conductors (Electric); Copper; Finite Difference Time-Domain Analysis; High-Speed Signal Designs; Material-Independent Coefficients; Modelling; Rational Function Approximation; Skin Effect; Skin Effect Loss; Strip Line; Strip Lines; Surface Impedance; Surface Impedance Boundary Condition Algorithm; Dielectric Losses; Electromagnetic Compatibility; Finite Difference Time Domain Method; Clock Speed; Data Rates; Finite Conductivity; High-Speed Signals; Lossy Nature; Surface Impedance Boundary Condition; Wide Strips
International Standard Book Number (ISBN)
780372778
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2002