Abstract
A statistical cable bundle model is developed to account for the random disturbance of the wire positions along hand-assembled cable bundles. The nonuniform random bundles are modeled as n-cascaded segments of a uniform multiconductor transmission line. At each section, all wire positions are disturbed with random numbers obeying a Gaussian distribution. In addition, a spline interpolation function is used to improve the continuity of wires winding along the bundle. The wire crosstalk and the common-mode (CM) current distribution along the bundle can be calculated with simulation program with integrated circuit emphasis (SPICE)-like solvers. By injecting the CM current along the bundle into a full-wave tool, e.g., finite-difference time domain (FDTD), as impressed current sources, the system-level electromagnetic emissions from the cable bundles can be predicted. The model has been experimentally validated with a controlled laboratory setup.
Recommended Citation
S. Sun et al., "Hand-Assembled Cable Bundle Modeling for Crosstalk and Common-Mode Radiation Prediction," IEEE Transactions on Electromagnetic Compatibility, vol. 49, no. 3, pp. 708 - 718, Institute of Electrical and Electronics Engineers (IEEE), Aug 2007.
The definitive version is available at https://doi.org/10.1109/TEMC.2007.897142
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Cable Bundles; Common-Mode (CM) Current; Crosstalk; Electromagnetic Interference (EMI); Multiconductor Transmission Line (MTL); Statistical; Cables; Color; Crosstalk; Electric Lines; Electromagnetic Compatibility; Electromagnetic Pulse; Electromagnetic Wave Interference; Electromagnetism; Finite Difference Time Domain Method; Integrated Circuits; Linearization; Magnetic Field Measurement; Power Transmission; Transmission Line Theory; Wire; SPICE
International Standard Serial Number (ISSN)
0018-9375; 1558-187X
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2007 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2007