Abstract

A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2006: Aug. 14-18, Portland, OR)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Packaging; Finite Difference Methods; Equivalent Circuits; Transmission Line Matrix Methods; Integral Equations; Time Domain Analysis; SPICE; Sparse Matrices; Electromagnetic Modeling; Dielectric Losses; Algorithms; Capacitors; Dielectric Losses; Finite Difference Time Domain Method; Decoupling Capacitors; Matrix Equations; Power Delivery Networks; Power Distribution Networks (PDN); Printed Circuit Boards; Equivalent Circuit; FDTD; Power Delivery Network

International Standard Book Number (ISBN)

978-1424402939

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2006

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