Abstract
A statistical cable harness model is developed to account for the random disturbance of the wire positions along hand-assembled bundles. The non-uniform random bundles are modeled as n-cascaded segments of uniform multi-conductor transmission line. At each section, all wire positions are disturbed with random numbers obeying a Gaussian distribution. In addition, a spline interpolation function is used to improve the smoothness of wires winding along the bundle. The common-mode current distribution along the bundle calculated with SPICE is injected into a full-wave tool, e.g., FDTD, as impressed current sources. Thus, the full-vehicle electromagnetic emissions from the automotive harness can be predicted efficiently. The model has been experimentally validated with a controlled laboratory setup.
Recommended Citation
S. Sun et al., "Common-Mode Radiation Resulting from Hand-Assembled Cable Bundles on Automotive Platforms," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR), vol. 2, pp. 298 - 303, Institute of Electrical and Electronics Engineers (IEEE), Aug 2006.
The definitive version is available at https://doi.org/10.1109/ISEMC.2006.1706315
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2006: Aug. 14-18, Portland, OR)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
EMI; Automotive EMC; Cable Bundles; Common-Mode Current; Random; Statistical; Electric Cables; Electric Lines; Gaussian Distribution; Interpolation; Mathematical Models; Statistical Methods; Automotive Industry; Automotive Engineering; Power Cables; Wire; Electromagnetic Interference; Electromagnetic Compatibility; Spline; Laboratories; Fractals; Routing
International Standard Book Number (ISBN)
978-1424402939
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2006