Abstract
Cavity model with segmentation method is extended to the analysis of radio frequency interference (RFI) problems in a shielding enclosure with printed circuit boards (PCBs) . Sixteen different Green's functions, instead of one in the conventional segmentation method developed for PCB cavities, are introduced to describe the fields in various cavities formed by enclosure walls and PCB copper planes. Both horizontal and vertical connections among these cavities are achieved by enforcing the boundary conditions along their common interfaces. Numerical examples demonstrate the efficiency and accuracy of the method by compared with full wave simulations.
Recommended Citation
Y. Zhang and X. Dong and Z. Yu and F. de Paulis and G. Feng and J. A. Mix and D. Hua and K. P. Slattery and J. L. Drewniak and J. Fan, "Efficient Prediction of RF Interference in a Shielding Enclosure with PCBs using a General Segmentation Method," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany), Institute of Electrical and Electronics Engineers (IEEE), Sep 2008.
The definitive version is available at https://doi.org/10.1109/EMCEUROPE.2008.4786812
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008: Sep. 8-12, Hamburg, Germany)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
RFI; Cavity Model; Segmentation Method; Shielding Enclosure; Enclosure Walls; Full-Wave Simulations; Numerical Examples; Radio Frequency Interferences; RF Interferences; Differential Equations; Electric Inverters; Electromagnetic Compatibility; Electromagnetic Shielding; Enclosures; Green's Function; Plastic Molds; Printed Circuit Manufacture; Radiation Protection; Radio Interference; Shielding; Printed Circuit Boards
International Standard Book Number (ISBN)
978-1424427376
International Standard Serial Number (ISSN)
2325-0356; 2325-0364
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Sep 2008
