Abstract
The power distribution network in a printed circuit board (PCB) inside a compact-size enclosure is an effective path for high-speed digital noise to be coupled to the RF receivers inside the same enclosure, causing RF interference (RFI) issues. This noise coupling mechanism from PCB to shielding enclosure is investigated in this paper using the cavity model and the segmentation technique. In this approach, the structure of an enclosure with a PCB inside is divided into cavities with both horizontal and vertical connections. Modeling result agrees well with full wave simulations, and the simulation time is considerably reduced. Furthermore, the relationship among the noise coupling, the PCB-related resonances, and the enclosure-related resonances is studied as well.
Recommended Citation
Z. Yu et al., "Analysis of Noise Coupling from Printed Circuit Board to Shielding Enclosure," Proceedings of the Electrical Performance of Electronic Packaging, 2008. IEEE-EPEP, Institute of Electrical and Electronics Engineers (IEEE), Oct 2008.
The definitive version is available at https://doi.org/10.1109/EPEP.2008.4675902
Meeting Name
Electrical Performance of Electronic Packaging, 2008. IEEE-EPEP
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic Shielding; Interference; Couplings; Printed circuits; Radio - Receivers and reception; Radio frequency
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Oct 2008
