Abstract
Engineering of absorbing materials for gaskets that would be used between two metal plates to reduce electromagnetic emissions and improve immunity of electronic equipment is considered. An analytical model of a composite based on the Maxwell Garnett formulation for multiphase mixtures, as well as the shielding effectiveness of this material, are presented. The full-wave numerical computational results for the structure consisting of two overlapping metal plates and an engineered gasket composite material in the place of the overlap are presented.
Recommended Citation
M. Koledintseva et al., "Engineering of Absorbing Gaskets Between Metal Plates," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2007, Honolulu, HI), Institute of Electrical and Electronics Engineers (IEEE), Jul 2007.
The definitive version is available at https://doi.org/10.1109/ISEMC.2007.120
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2007: Jul. 9-13, Honolulu, HI)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Maxwell Equations; Composite Materials; Electromagnetic Interference; Electromagnetic Shielding; Interference Suppression; Numerical Analysis; Carbon Inclusions; Ceramic; Dielectric Base Material; Electromagnetic Shielding Effectiveness; Ferrite; Maxwell Garnett Formulation; Amplifiers (Electronic); Ceramic Materials; Electric Inverters; Electromagnetic Compatibility; Electromagnetism; Electronic Equipment; Garnets; Gaskets; Machinery; Magnetic Materials; Magnetic Shielding; Maxwell Equations; Oscillators (Electronic); Plastic Molds; Plates (Structural Components); Radiation Protection; Radiation Shielding; Shielding; Absorbing Materials; Analytical Models; Computational Results; Electromagnetic Emissions; Metal Plates; Multiphase Mixtures; Shielding Effectiveness
International Standard Book Number (ISBN)
978-1424413508
International Standard Serial Number (ISSN)
2158-110X; 2158-1118
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2007 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2007