A Practical Approach to Analyze Copper Surface Roughness Effects with Applications to Stripline Structures
Abstract
Conductor loss due to the roughened metal foil surface has significant effects on high-speed signals propagation on backplane traces designed for 10+ Gbps network. A practical method to evaluate these effects, including the signal attenuation and the propagation phase velocity, is proposed in this paper. A periodic structure is assumed to model the morphology of the roughness profile. The equivalent surface impedance is extracted from the grating surface wave propagation constant to model the roughness. This modified surface impedance can hence be used in the traditional attenuation constant formula to calculate the actual conductor loss. This approach is validated using both full-wave simulation tool and measurement, and is shown to be able to provide robust result within 0.2 dB/m relative error.
Recommended Citation
X. Guo et al., "A Practical Approach to Analyze Copper Surface Roughness Effects with Applications to Stripline Structures," Proceedings of the 45th International Symposium on Microelectronics (2012, San Diego, CA), pp. 1068 - 1072, International Microelectronics Assembly and Packaging Society, Sep 2012.
The definitive version is available at https://doi.org/10.4071/isom-2012-THP22
Meeting Name
45th International Symposium on Microelectronics (2012: Sep. 9-13, San Diego, CA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Attenuation Constants; Conductor Loss; Floquet Modes; Full-Wave Simulations; High-Speed Signals; Signal Attenuation; Stripline Structures; Surface Impedances; Microelectronics; Periodic Structures; Strip Telecommunication Lines; Surface Roughness; Surface Waves; Wave Propagation; Dielectric Losses; Periodic Structure And Floquet Mode; Stripline
International Standard Serial Number (ISSN)
2380-4505
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2012 International Microelectronics Assembly and Packaging Society, All rights reserved.
Publication Date
01 Sep 2012