An Application of Utilizing the System-Efficient-ESD-Design (SEED) Concept to Analyze an LED Protection Circuit of a Cell Phone
Abstract
An LED circuit of a cell phone is analyzed using the System-Efficient-ESD-Design (SEED) methodology. The method allows simulation of the ESD current path, and the interaction mechanisms between the clamp and the on-chip ESD protection circuit. The I-V curve and the non-linear behavior under high current pulses of every component including R, L, C, and ferrite beads are measured and modeled. By combining all of the component models, a complete circuit model is built for predicting the circuit behavior and damaging threshold at a given setting-voltage of a Transmission Line Pulser (TLP).
Recommended Citation
T. Li et al., "An Application of Utilizing the System-Efficient-ESD-Design (SEED) Concept to Analyze an LED Protection Circuit of a Cell Phone," Proceedings of the 2012 IEEE International Symposium on Electromagnetic Compatibility (2012, Pittsburgh, PA), pp. 346 - 350, Institute of Electrical and Electronics Engineers (IEEE), Aug 2012.
The definitive version is available at https://doi.org/10.1109/ISEMC.2012.6351824
Meeting Name
2012 IEEE International Symposium on Electromagnetic Compatibility (2012: Aug. 6-10, Pittsburgh, PA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Cell Phone; Circuit Behaviors; Circuit Models; Component Model; Current Paths; Ferrite Beads; High-current Pulse; I - V Curve; Interaction Mechanisms; Nonlinear Behavior; On-chip ESD Protection; Protection Circuits; Cellular Telephones; Electromagnetic Compatibility; Electrostatic Devices; Electrostatic Discharge; Mobile Phones; Telecommunication Equipment; Light Emitting Diodes
International Standard Book Number (ISBN)
978-1-4673-2061-0
International Standard Serial Number (ISSN)
2158-110X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2012