Sheet Absorbing Material Modeling and Application for Enclosures
Abstract
This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.
Recommended Citation
A. Radchenko et al., "Sheet Absorbing Material Modeling and Application for Enclosures," Proceedings of the 2013 IEEE International Symposium on Electromagnetic Compatibility (2013, Denver, CO), pp. 645 - 650, Institute of Electrical and Electronics Engineers (IEEE), Aug 2013.
The definitive version is available at https://doi.org/10.1109/ISEMC.2013.6670491
Meeting Name
2013 IEEE International Symposium on Electromagnetic Compatibility (2013: Aug. 5-9, Denver, CO)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Absorber Material; Absorbing Materials; Electronic Circuitry; Full Waves; Material Types; Thin Sheet; Electromagnetic Compatibility; Electromagnetic Fields; Enclosures
International Standard Book Number (ISBN)
978-1-4799-0408-2
International Standard Serial Number (ISSN)
2158-110X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2013