Modelling Electromagnetic Field Coupling from an ESD Gun to an IC
Abstract
IC designers require fast and accurate methods of simulating immunity of ICs to ESD events to adequately predict and analyze ESD issues. The common method of predicting electromagnetic field coupling from an ESD gun to an IC, however, requires substantial simulation time and does not typically account for the full IC layout. Here we propose an efficient methodology for calculating the electromagnetic field coupling from an ESD gun to an IC while fully considering the non-linear circuit elements in the IC core. Voltages and currents within the IC are found by merging full-wave simulations of an ESD gun with a SPICE model of the IC and the coupled electromagnetic energy. The capability of the proposed method was verified through experiments on a pseudo-integrated circuit structure. Results show the promise of the method. This hybrid modelling method can significantly accelerate simulation time compared with traditional full-wave modelling techniques and can allow the designer to better explore the variation in coupling that occurs with small changes in the test setup, such as the position and orientation of the gun and IC.
Recommended Citation
J. Zhang et al., "Modelling Electromagnetic Field Coupling from an ESD Gun to an IC," Proceedings of the 2011 IEEE International Symposium on Electromagnetic Compatibility (2011, Long Beach, CA), pp. 553 - 558, Institute of Electrical and Electronics Engineers (IEEE), Aug 2011.
The definitive version is available at https://doi.org/10.1109/ISEMC.2011.6038373
Meeting Name
2011 IEEE International Symposium on Electromagnetic Compatibility (2011: Aug. 14-19, Long Beach, CA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Integrated Circuit Modeling; Electrostatic Discharge; Couplings; Voltage Measurement; Pins; Predictive Models
International Standard Book Number (ISBN)
978-1-4577-0812-1
International Standard Serial Number (ISSN)
2158-110X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2011