bModel of Secondary ESD for a Portable Product

Abstract

If a non grounded piece of metal is subjected to an ESD, a spark between this metal part and grounded metal parts can occur. This discharge is generally called "secondary ESD". These secondary ESDs are often very close to the electronics and, as this article shows, can have much higher currents and shorter rise times than the original ESD. For that reason secondary ESD poses a very high risk of causing soft- and hard errors in the affected Device Under Test (DUT). A methodology to model the secondary Electrostatic Discharge (ESD) inside a portable electronic product is presented. It is a hybrid method that combines linear descriptions of the ESD generator and the DUT with the nonlinear spark model and a model for the initiation delay (statistical time lag) of the spark. Measurement results are presented comparing discharge currents and time delays for two cases: secondary discharge between metal rod and ESD target, and inside a portable product.

Meeting Name

2011 IEEE International Symposium on Electromagnetic Compatibility (2011: Aug. 14-19, Long Beach, CA)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cosimulation; Device Under Test; Discharge Currents; Electrostatic Discharge (ESD) Generator; ESD Generator; Full Wave Modeling; Hybrid Method; Linear Description; Measurement Results; Metal Parts; Portable Electronics; Portable Products; Secondary Electrostatic Discharge; Time Lag; Electric Sparks; Electromagnetic Compatibility; Electromagnetism; Electrostatic Discharge; Metals; Electrostatic Devices; Co-simulation; Secondary Electrostatic Discharge; SPICE

International Standard Book Number (ISBN)

978-1-4577-0812-1

International Standard Serial Number (ISSN)

2158-110X

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2011

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