Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2017

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S-Parameters Quality Estimation in Physical Units, Mikheil Tsiklauri, Nana Dikhaminjia, Jun Fan, and James L. Drewniak

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Sparse Emission Source Microscopy for Rapid Emission Source Imaging, Ling Zhang, Victor Khilkevich, Xiangyang Jiao, Xiao Li, Sukhjinder Toor, Alpesh U. Bhobe, Kyoungchoul Koo, David Pommerenke, and James L. Drewniak

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Studying the Effects of Location Offset on the Evaluation of MIMO Performance Based on the Radiated Two-Stage (RTS) Method, Yansheng Wang, Songping Wu, Zhiping Yang, Penghui Shen, and Jun Fan

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TEM-Like Launch Geometries and Simplified De-Embedding for Accurate Through Silicon Via Characterization, Francesco de Paulis, Stefano Piersanti, Qian Wang, Jonghyun Cho, Nicholas Erickson, Brice Achkir, Jun Fan, James L. Drewniak, and Antonio Orlandi

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The Advantages of the RTS Method in MIMO OTA Measurements, Penghui Shen, Yihong Qi, Jun Fan, and Yansheng Wang

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Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC, DongHyun Kim; Yongwoo Kim; Jonghyun Cho; and For full list of authors, see publisher's website.

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Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards, Lingyun Ye, Caixia Li, Xinglin Sun, Shuai Jin, Bichen Chen, Xiaoning Ye, and Jun Fan

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Variability Analysis of Crosstalk among Differential Vias using Polynomial-Chaos and Response Surface Methods, Yansheng Wang, Shuai Jin, Srinath Penugonda, Ji Chen, and Jun Fan

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Wideband Characterization of LCD Baseband Noise Modulation for RF Interference in Mobile Phones, Chulsoon Hwang, Takashi Enomoto, Junji Maeshima, Kenji Araki, David Pommerenke, and Jun Fan

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Worst Case Prediction of Shielding Effectiveness of Board Level Shields, Ruijie He, Victor Khilkevich, Ling Zhang, Mohammad Ali Khorrami, Paul Dixon, and Yoeri Arien

Submissions from 2016

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Analysis of High Frequency Characteristics of Power Inverter using Accurate IGBT Model based on Datasheet and Measurement, Hyunwoo Shim; Hongseok Kim; Jinwook Song; DongHyun Kim; and For full list of authors, see publisher's website.

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Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link, DongHyun Kim; Youngho Kim; Heegon Kim; and For full list of authors, see publisher's website.

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Analysis on Via Design for Impedance Mismatch Minimization in High Speed Channel, Jaemin Lim; Joungho Kim; DongHyun Kim; and For full list of authors, see publisher's website.

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Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package, Shuai Jim, Ji Zhang, Jane Lim, Kelvin Qiu, Rick Brooks, and Jun Fan

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An EMI Estimation for Shielding Edge Treaments on a Printed Circuit Board, Siqi Bai, Qian Liu, Kartheek Nalla, Jing Li, James L. Drewniak, Samuel R. Connor, Michael A. Cracraft, and Bruce Archambeault

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An Equivalent Circuit Model for the Wire-to-Surface Junction Based on Method of Moments, Yansheng Wang, Richard Kautz, Nevin Altunyurt, and Jun Fan

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A Novel Shielding Effectiveness Matrix of Small Shield Cans Based on Equivalent Dipole Moments for Radio-Frequency Interference Analysis, Chulsoon Hwang, Jaedeok Lim, Gyuyeong Cho, Harkbyeong Park, and Hyunho Park

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A Simple Miniature Ultra-Wide Band Magnetic Field Probe Design for Magnetic Near-Field Measurements, Zhaowen Yan, Jianwei Wang, Wei Zhang, Yansheng Wang, and Jun Fan

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A Vectorless Approach for Predicting Switching Activity in a Digital Circuit, Liehui Ren, Shishuang Sun, Manish Deo, Javid Jaffari, Praveen K. Anmula, Peter A. Boyle, James L. Drewniak, and Daryl G. Beetner

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Bandwidth Improvement Technique for an Edge Mount SMA Launch Structure in Multilayer Boards, Chulsoon Hwang, Muqi Ouyang, and Jun Fan

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Capacitance-Enhanced Through-Silicon Via for Power Distribution Networks in 3D ICs, Chulsoon Hwang, Brice Achkir, and Jun Fan

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Characterizing EMI Radiation Physics Corresponding to Distributive Geometry Features using the PEEC Method, Ying S. Cao, Yansheng Wang, Li Jun Jiang, Albert E. Ruehli, James. L. Drewniak, and Jun Fan

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Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage, Hongseok Kim; Chiuk Song; DongHyun Kim; and For full list of authors, see publisher's website.

Design Methodology for Behavioral Surface Roughness Model, Xinyao Guo, Han Gao, Guangyao Shen, Qian Liu, Victor Khilkevich, James L. Drewniak, Soumya De, Scott Hinaga, and Douglas Yanagawa

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Development of Simple Physics-Based Circuit Macromodel from PEEC, Natalia G. Bondarenko, Tamar Makharashvili, Junping He, Phil Berger, James L. Drewniak, Albert E. Ruehli, and Daryl G. Beetner

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Differential Probe Characterization, Qian Wang, Yuanci Gao, Jun Fan, James L. Drewniak, and Richard Zai

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Discrete Hilbert Transform Based Delay Causality Enforcement for Network Parameters, Mikheil Tsiklauri, Mikhail Zvonkin, Nana Dikhaminjia, Jun Fan, and James L. Drewniak

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Effect of Human Activities and Environmental Conditions on Electrostatic Charging, Atieh Talebzadeh, Mahdi Moradian, Yunan Han, David E. Swenson, and David Pommerenke

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Effects of Metal Structures on Magneto-Inductive Coupled Coils, Niaz Ahmed, Y. Rosa Zheng, and David Pommerenke

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Electromagnetic Interference on Analog-To-Digital Converters from High-Power Wireless Power Transfer System for Automotive Charger, Sunkyu Kong, Bumhee Bae, DongHyun Kim, Hongseok Kim, Chiuk Song, and Joungho Kim

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EMI Coupling Paths in Silicon Optical Sub-Assembly Package, Jing Li, Xiao Li, Xiangyang Jiao, Sukhjinder Toor, Ling Zhang, Alpesh U. Bhobe, James L. Drewniak, and David Pommerenke

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EMI Reduction in Wireless Power Transfer System using Spread Spectrum Frequency Dithering, Hongseok Kim, Jonghoon J. Kim, Seungtaek Jeong, Seongsoo Lee, Yeonje Cho, DongHyun Kim, and Joungho Kim

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Emission Source Microscopy Technique for EMI Source Localization, Pratik Maheshwari, Hamed Kajbaf, Victor Khilkevich, and David Pommerenke

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Estimating the Near Field Coupling from SMPS Circuits to a Nearby Antenna using Dipole Moments, Chunyu Wu, Yansheng Wang, Liang Li, Jingnan Pan, Jun Fan, Lijuan Qu, and Joakim Eriksson

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Extracting Characteristic Impedance of a Transmission Line Referenced to a Meshed Ground Plane, Jiayi He, Chulsoon Hwang, Jingnan Pan, Gyu-Yeong Cho, Bumhee Bae, Hark-Byeong Park, and Jun Fan

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Extraction of the Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling, Stefano Piersanti, E. Pellegrino, Francesco de Paulis, Antonio Orlandi, Joungho Kim, and Jun Fan

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Fast and Accurate TIS Testing Method for Wireless User Equipment with RSS Reporting, Penghui Shen, Yihong Qi, Wei Yu, Fuhai Li, and Jun Fan

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Fast Band-Sweep Total Isotropic Sensitivity Measurement, Zixin Liu, Yihong Qi, Fuhai Li, Wei Yu, Jun Fan, and Ji Chen

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Fast Method for EIS Sweep Test, Penghui Shen, Zixin Liu, Yihong Qi, Wei Yu, and Jun Fan

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Fast Method for OTA Performance Testing of Transmit-Receive Cofrequency Mobile Terminal, Penghui Shen, Yihong Qi, Wei Yu, Fuhai Li, and Jun Fan

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Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board, Ketan Shringarpure, Siming Pan, Jingook Kim, Jun Fan, Brice Achkir, Bruce Archambeault, and James L. Drewniak

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Front Delay Based Causality for Network Parameters, Mikheil Tsiklauri, Nana Dikhaminjia, Jun Fan, James L. Drewniak, and Mikhail Zvonkin

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Impact of Voltage Bias on Through Silicon Vias (TSV) Depletion and Crosstalk, Stefano Piersanti, Francesco de Paulis, Antonio Orlandi, Jun Fan, James L. Drewniak, and Brice Achkir

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Improving Kinematic Accuracy of Soft Wearable Data Gloves by Optimizing Sensor Locations, DongHyun Kim, Sang Wook Lee, and Hyung-Soon Park

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Inductance Extraction for Physics-Based Modeling of Power Net Area Fills with Complex Shapes and Voids using the Plane-Pair PEEC Method, Siqi Bai, Chenxi Huang, Biyao Zhao, Jun Fan, Albert E. Ruehli, James L. Drewniak, Bruce Archambeault, Samuel Connor, Michael Cracraft, Matteo Cocchini, and Brice Achkir

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Interference Characterization of Cellular IoT Modules Based on BER Measurements, Zhaohai Jiang, Harald Gossner, David Pommerenke, and Walter Hänsch

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Investigation of the Radiated Emissions from High-Speed/High-Density Connectors, Hungchuan Chen, Samuel R. Connor, Matthew S. Halligan, Xinxin Tian, Xiao Li, Bruce Archambeault, James L. Drewniak, and Tzonglin Wu

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Low Power Magneto-Inductive Communication System for Structural Health Monitoring, Niaz Ahmed, Y. Rosa Zheng, and David Pommerenke

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Measurement Methodology for Field-Coupled Soft Errors Induced by Electrostatic Discharge, Zhen Li, Pratik Maheshwari, and David Pommerenke

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Minimal Detectable Signal During Current Measurement in a CISPR 25 Set-Up, Zongyi Chen, Jin Jia, Stephan Frei, Syed Huq, and David Pommerenke