On-chip Sensors to Measure Level of Transient Events

Abstract

On-die circuits were developed to measure the size of transient electrical events experienced at I/O pads. The circuits allow an integrated circuit (IC) to determine the peak voltages across the electrostatic discharge diodes during the event. Experiments and simulations with a 90 nm test chip show the sensor can determine the peak magnitude of the transient event within 1 A for events larger than 0.7 A and duration longer than 1 ns.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Comments

National Science Foundation, Grant IIP-1440110

International Standard Serial Number (ISSN)

0739-5159

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

18 Oct 2017

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