A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs

Abstract

A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Sponsor(s)

National Science Foundation (U.S.)

Comments

This material is based upon work supported by the National Science Foundation (NSF) under Grants IIP-1440110.

Keywords and Phrases

Capacitors; Ceramic Capacitors; Electric Network Analysis; Equivalent Circuits; Decoupling Capacitor; Multi-Layer Ceramic Capacitor; PDN Noise; Power Distribution Network; Power Distribution Network Design; Power Distribution Network Impedance; Voltage Ripples; Z-Directed Component (ZDC); Printed Circuit Boards; Equivalent Circuit; Switch Current; Voltage Ripple

International Standard Serial Number (ISSN)

2162-2264; 2162-2272

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Nov 2017

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