Investigation of Statistical Eye-Diagram Estimation Method for HBM Including ISI, X-Talk, and Power Noise

Abstract

Statistical link analysis and link budget calculation is the essential part for current high-speed system design. Because of the difficulty of low bit-error rate (BER) simulation at SPICE transient solver, several methods were proposed to simulate low BER in a short time. Single-bit response (SBR) method is the most basic method; it uses SBR to construct the arbitrary waveform under the assumption of linear and time-invariant (LTI) system. However it cannot be applied to real system because I/O drivers are nonlinear. There exists a method to include these nonlinearity of real system, which is called as multiple-edge response (MER) method. There's a few paper to explain MER method, but no paper covers statistical analysis for the real system including ISI, x-talk, and power noise. In this paper, we demonstrate MER method for simple, but real HBM channel and also shows calculation burden of MER as the number of channels increase or MER order increases. Additionally, simple concept is proposed to apply MER on real HBM channel with more than a thousand I/Os.

Meeting Name

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI (2017: Aug. 7-11, Washington, DC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Bit error rate; Budget control; Crosstalk; Electromagnetic compatibility; SPICE; Step response; Eye diagrams; Link analysis; Nonlinearity; Power noise; Power-supply noise; PSIJ; Statistical; Statistics; BER; Bit response; DER; Eye-diagram; HBM; I/O driver; ISI; MER; SBR; Statistical eye diagram

International Standard Book Number (ISBN)

978-1-5386-2229-2

International Standard Serial Number (ISSN)

1077-4076; 2158-1118

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2017

Link to Full Text

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