A Planar Low-Profile Meander Antenna (PLMA) Design for Wireless Terminal Achieving between Intrasystem EMC and Isolation in Multiantenna Systems

Abstract

In this paper, a meander line internal antenna used for wireless terminal is proposed. The current of this antenna is mostly distributed on the antenna radiator itself, rather than on the main board of the wireless device. As a result, the chance of having intrasystem electromagnetic compatibility issues, which usually result in receiver desensitization in wireless radios, can be significantly reduced. The antenna has good radiation performance in the vertical polarization with a low physical profile, compared to the existing antenna designs for typical wireless terminals. The antenna has efficiency similar to the monopole antenna with much less reference/ground plane dependence, which is important for high sensitivity radio design. Further, the mutual coupling (i.e., isolation) between the two such antennas is studied and the envelope correlation coefficient between the two such antennas when they are placed in one system is found to be low, which is important for better throughput for a multiple input and multiple output system. Both simulation and measurement results demonstrate the proposed design.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Antenna radiation; Electromagnetic compatibility; Envelope correlation coefficient; Internal antennas; Multi-antenna systems; Multiple input and multiple output systems; Radiation performance; Simulations and measurements; Vertical polarization; Wireless terminals; Monopole antennas; Envelop correlation coefficient (ECC); Intrasystem electromagnetic compatibility (EMC); Isolation; Low profile; Planar meander antenna; Receiver desensitization

International Standard Serial Number (ISSN)

0018-9375; 1558-187X

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jun 2017

Link to Full Text

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