A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs
Abstract
A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors.
Recommended Citation
B. Zhao et al., "A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017, Washington, D.C.), pp. 225 - 230, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/ISEMC.2017.8077871
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017: Aug. 7-11, Washington, DC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
National Science Foundation (U.S.)
Keywords and Phrases
Capacitors; Ceramic Capacitors; Electric Network Analysis; Electromagnetic Compatibility; Equivalent Circuits; Decoupling Capacitor; Multi-Layer Ceramic Capacitor; PDN Noise; Power Distribution Network; Power Distribution Network Design; Power Distribution Network Impedance; Voltage Ripples; Z-Directed Component (ZDC); Printed Circuit Boards; Equivalent Circuit; Switch Current; Voltage Ripple
International Standard Book Number (ISBN)
978-1538622315; 978-1538622292
International Standard Serial Number (ISSN)
2158-1118
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2017
Comments
This material is based upon work supported by the National Science Foundation (NSF) under Grants IIP-1440110.