Characterizing EMI Radiation Physics for Edge- and Broad-Side Coupled Connectors
Abstract
Electromagnetic radiation for a printed circuit board (PCB) midplane connector is studied in this paper. By applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified for both edge-side coupled and broad-side coupled connectors. Furthermore, the radiation characteristics for these connectors are compared.
Recommended Citation
Y. S. Cao and X. Wang and W. Mai and Y. Wang and L. J. Jiang and A. E. Ruehli and S. He and H. Zhao and J. Hu and J. Fan and J. L. Drewniak, "Characterizing EMI Radiation Physics for Edge- and Broad-Side Coupled Connectors," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017, Washington, D.C.), pp. 766 - 771, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/ISEMC.2017.8077970
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017: Aug. 7-11, Washington, DC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
National Science Foundation (U.S.)
Keywords and Phrases
Connectors (Structural); Electromagnetic Compatibility; Electromagnetic Pulse; Electromagnetic Waves; Heat Radiation; Integral Equations; Signal Interference; Characteristic Modes; Hot Spot; Printed Circuit Boards (PCB); Radiated Power; Radiation Characteristics; Radiation Physics; Connectors; Electromagnetic Interference (EMI); Radiation
International Standard Book Number (ISBN)
978-1538622315; 978-1538622292
International Standard Serial Number (ISSN)
2158-1118
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2017
Comments
This material is based upon work supported by the National Science Foundation under Grant No. IIP-1440110.