Determining Equivalent Dipoles using a Hybrid Source-Reconstruction Method for Characterizing Emissions from Integrated Circuits

Abstract

An efficient emission model for radiation problems in integrated circuits (ICs) is required at the early phase of industrial design. Traditional source-reconstruction methods rely exclusively on near-field scanning and lack the flexibility needed to handle varying IC work conditions. The proposed hybrid model can build a physical connection to the IC's inherent electric properties; therefore, after simple parameter adjustments, it can be applied to any mode of operation. The complete model consists of two sets of equivalent dipoles; one is converted directly from the current/voltage information distributed along the IC package, while the other initially is solved from linear equations that describe the relationship between the dipoles and scanned fields. Then, they are multiplied by a scaling factor to adapt to varying IC work conditions. The emission behavior of an 8-bit commercial microcontroller was reasonably simulated in full-wave solver under various working conditions. The proposed hybrid equivalent source model correctly predicted the simulated reference fields at each operation mode. The feasibility and flexibility of the proposed modeling method have been well validated.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Equivalent circuits; Industrial emissions; Product design; Timing circuits; Efficient emission; Integrated circuits (ICs); Mode of operations; Near-field scanning; Parameter adjustments; Physical connections; Radiation problems; Source reconstruction; Hybrid integrated circuits; Current/voltage distributed in integrated circuit (IC); equivalent dipoles; integrated circuit (IC) emission; modeling

International Standard Serial Number (ISSN)

0018-9375

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Apr 2017

Link to Full Text

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