A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement

Abstract

In this paper, a miniature electric field probe with an ultrawideband of 9 kHz-20 GHz is proposed, fabricated, and tested. The electric field probe is fabricated on a four-layer printed circuit board using high-performance and low-loss Rogers material (εr = 3.48 and tan δ = 0.0037). Coax-Thru-hole via array is used to control the signal via impedance to achieve impedance 50 Ω match over the whole working band, reducing the harmful influence on the probe's characteristic. The ground vias, called via fence, are utilized to suppress the resonance caused by the parallel-plate mode of conductor-backed coplanar waveguide (CB-CPW), expanding the working frequency band. Experimental result shows |S21| rather smooth in operation band, demonstrating the working frequency band is up to 9 kHz-20 GHz. The electric field probe has a 2-3 mm spatial resolution, which has a good ability to locate the interference source.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Sponsor(s)

National Natural Science Foundation (China)

Comments

This work was supported by the National Natural Science Foundation of China under Grant 61271044 and Grant 61427803.

Keywords and Phrases

Coplanar waveguides; Electric fields; Frequency bands; Printed circuit boards; Probes; Ultra-wideband (UWB); Waveguides; Conductor backed coplanar waveguides; Interference sources; Near-field measurement; Operation bands; Parallel plate modes; Spatial resolution; Ultrawideband electric fields; Working frequency; Electric losses; Coax-Thru-hole via array; Electric field probe; Miniature; Ultrawideband; Via fence

International Standard Serial Number (ISSN)

0018-9456; 1557-9662

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2017

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