Abstract
Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.
Recommended Citation
C. Wang et al., "Coupling Between Differential Signals and the DC Power-Bus in Multilayer PCBs," IEEE Transactions on Advanced Packaging, vol. 28, no. 2, pp. 337 - 345, Institute of Electrical and Electronics Engineers (IEEE), May 2005.
The definitive version is available at https://doi.org/10.1109/TADVP.2005.846938
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Analytical Cavity Model; Common-Mode Transfer Impedances; Coupled Circuits; Coupling; DC Power Bus; Differential Signaling; Differential Signals; Electromagnetic Interference; Electronic Engineering Computing; Finite Difference Time-Domain Analysis; Full-Wave Finite-Difference Time-Domain Simulations; Microstrip Lines; Multilayer PCBs; Power-Bus Noise; Printed Circuits; Signal Current Imbalance; Signal Imbalance; Signal Integrity; Via Transition
International Standard Serial Number (ISSN)
1521-3323; 1557-9980
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2005
