Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements
Abstract
One of the most widely used methods for evaluating the electromagnetic compatibility of integrated circuits (ICs) involves mounting the IC on a printed circuit board embedded in the wall of a TEM cell. TEM cell measurements are influenced by both electric and magnetic field coupling from the IC and its package. This paper describes how a TEM cell and a hybrid can be used to isolate electric field coupling from magnetic field coupling. Knowledge of the dominant field coupling mechanism can be used to troubleshoot radiated emissions problems due to ICs.
Recommended Citation
V. Kasturi et al., "Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements," Proceedings of the 2006 IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR), Institute of Electrical and Electronics Engineers (IEEE), Jan 2006.
The definitive version is available at https://doi.org/10.1109/ISEMC.2006.1706339
Meeting Name
2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 (2006: Aug. 14-18, Portland, OR)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Component; Field Coupling; Package
International Standard Book Number (ISBN)
1-4244-0293-X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 2006
