Modeling Electromagnetic Radiation at High-Density PCB/connector Interfaces
Abstract
Electromagnetic radiation for a commercial printed circuit board (PCB) connector is investigated in this paper. The simulation models of the connector are shown to be validated by comparing measured and simulated S-parameters. Analytical formulas are provided to calculate the total loss and the radiated power from a PCB/connector structure when material losses are known. The total power loss for the considered geometry is shown to be dominated by material loss rather than radiated power loss. Termination schemes and additional geometry details in the connector model are also studied for their effects on the radiated power.
Recommended Citation
X. Tian and M. S. Halligan and X. Li and K. Kim and H. Chen and S. R. Connor and B. Archambeault and M. A. Cracraft and A. E. Ruehli and J. L. Drewniak, "Modeling Electromagnetic Radiation at High-Density PCB/connector Interfaces," Proceedings of the 2014 IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC), vol. 2014-September, no. September, pp. 97 - 102, Institute of Electrical and Electronics Engineers (IEEE), Sep 2014.
The definitive version is available at https://doi.org/10.1109/ISEMC.2014.6898950
Meeting Name
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 3-8, Raleigh, NC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Connectors (structural); Electromagnetic compatibility; Electromagnetic wave emission; Electromagnetic waves; Printed circuits; Scattering parameters; Analytical formulas; Material loss; Printed circuit board connector; Printed circuit boards (PCB); Radiated power; Total loss; Total power; Printed circuit boards; Electromagnetic radiation
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Sep 2014
