Time Lag of Secondary ESD in Millimeter-Size Spark Gaps
Abstract
This study relates to the delay of secondary electrostatic discharges (ESDs). The first motivation for this study is the fact that the delay value is a required input parameter for the simulation of the secondary ESD. The second motivation is that this delay is one limiting factor for the usage of spark gaps as protection devices. The objective is to determine the delay for different intended and unintended spark gap structures as this time delay will influence the peak current and rise time of the secondary ESD across these gaps. The intended application is ESD protection in consumer products, for that reason 0.5-3 mm gap distances and voltages up to 14 kV are considered at different humidity levels. Very long time lags are observed for clean sphere-to-sphere gaps requiring average field strengths >200 kV/cm to achieve a breakdown in a few nanoseconds in dry air. Humidity is shown to strongly reduce the time lag. However, if printed circuit board (PCB) spark gap geometries are considered the time lags are much smaller. Similar shorter lag times have been found in geometries that resemble more unintentional breakdown locations in a product
Recommended Citation
F. Wan et al., "Time Lag of Secondary ESD in Millimeter-Size Spark Gaps," IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 1, pp. 28 - 34, Institute of Electrical and Electronics Engineers (IEEE), Feb 2014.
The definitive version is available at https://doi.org/10.1109/TEMC.2013.2275922
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Atmospheric humidity; Consumer products; Electric sparks; Electrostatic discharge; Laser optics; Motivation; Breakdown; ESD protection; Gap distances; Humidity levels; Input parameter; Printed circuit boards (PCB); Protection device; Time lag; Electrostatic devices
International Standard Serial Number (ISSN)
0018-9375
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Feb 2014