Effect of Cooling on the Probe System Sensitivity for Low Signal Strength RFI Problems
Abstract
Only highly sensitive probe systems can detect the weak field strengths that cause radio-frequency-interference (RFI) problems typically found within cell phones. The sensitivity of the probe systems depends on the probe factor and on the noise floor. The effect of cooling by liquid nitrogen on the received signal strength and the noise floor of three resonant probe systems has been investigated. They operate at the GSM, GPS, and WiFi frequency bands. Cooling increases the Q-factor of these resonant probes, increases the received signal, and lowers the noise floor. The sensitivity of the system, defined as the signal strength at which the Signal-to-Noise Ratio is equal to 0 dB improves by 3-6 dB.
Recommended Citation
G. Li et al., "Effect of Cooling on the Probe System Sensitivity for Low Signal Strength RFI Problems," Proceedings of the 2013 IEEE International Symposium on Electromagnetic Compatibility (2013, Denver, CO), pp. 134 - 137, Institute of Electrical and Electronics Engineers (IEEE), Aug 2013.
The definitive version is available at https://doi.org/10.1109/ISEMC.2013.6670396
Meeting Name
2013 IEEE International Symposium on Electromagnetic Compatibility (2013: Aug. 5-9, Denver, CO)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Magnetic Field Probe; Quality Factors; Radiofrequency Interferences (RFI); Received Signal Strength; Received Signals; Sensitive Probe; Sensitivity of the Probe; Signal Strengths; Cooling; Electromagnetic Compatibility; Frequency Bands; Probes; Signal to Noise Ratio; Cooling Systems; Resonant Magnetic Field Probe
International Standard Book Number (ISBN)
978-1-4799-0408-2
International Standard Serial Number (ISSN)
2158-110X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2013