Both undergraduate and graduate students at Missouri S&T have an opportunity to get involved in research that will help determine the way that electronic products of the future are designed. Research in the Missouri S&T EMC Laboratory is sponsored by companies that are leaders in the electronics industry. Many of these projects are funded by the Center for Electromagnetic Compatibility, a group of companies with a common interest in electromagnetic compatibility problems and solutions.

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Submissions from 2019

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Corrections To: Effect of Inhomogeneous Medium on Fields above GCPW PCB for Near-Field Scanning Probe Calibration Application (IEEE Transactions on Electromagnetic Compatibility (2019) 61:1 (3-10) DOI: 10.1109/TEMC.2018.2817119), Shubhankar Marathe, Morten Soerensen, Victor Khilkevich, David Pommerenke, Jin Min, and Giorgi Muchaidze

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Effect of Inhomogeneous Medium on Fields Above GCPW PCB for Near-Field Scanning Probe Calibration Application, Shubhankar Marathe, Morten Soerensen, Victor Khilkevich, David Pommerenke, Jin Min, and Giorgi Muchaidze

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Low Cost Fast Frequency Switching Driver for Acousto-Optic Modulators Used in Laser Cooling, Aniket Bhandare, Abhishek Patnaik, David Pommerenke, Sachin Sharma, and Daniel Fischer

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Low Leakage Electromagnetic Field Level and High Efficiency using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System, Seongsoo Lee; DongHyun Kim; Yeonje Cho; and For full list of authors, see publisher's website.

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Noise Coupling Analysis from High Voltage Capacitor Discharging Circuit in an Electronic Safety and Arming Device, Hyungmin Kang; DongHyun Kim; Subin Kim; and For full list of authors, see publisher's website.

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Performance Improvement of Flexible Piezoelectric Energy Harvester for Irregular Human Motion with Energy Extraction Enhancement Circuit, Muhammad Bilawal Khan; DongHyun Kim; Jae Hyun Han; and For full list of authors, see publisher's website.

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Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material, Seungtaek Jeong; DongHyun Kim; Jinwook Song; and For full list of authors, see publisher's website.

Submissions from 2018

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A Comprehensive and Practical Way to Look at Crosstalk for Transmission Lines with Mismatched Terminals, Shaohui Yong, Kevin Cai, Bidyut Sen, Jun Fan, Victor Khilkevich, and Chunchun Sui

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A Generalized Multiple-Scattering Method for Modeling a Cable Harness with Ground Connections to a Nearby Metal Surface, Yansheng Wang Wang, Ying S. Cao, Dazhao Liu, Richard W. Kautz, Nevin Altunyurt, and Jun Fan

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Analysis of the Effect on Image Quality of Different Scanning Point Selection Methods in Sparse ESM, Morten Sorensen, Hamed Kajbaf, Victor Khilkevich, Ling Zhang, and David Pommerenke

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Analytical Equivalent Circuit Modeling for BGA in High-Speed Package, Shuai Jin, Dazhao Liu, Bichen Chen, Richard R. Brooks, Kelvin Qiu, Jane Lim, and Jun Fan

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Analytical Intra-System EMI Model using Dipole Moments and Reciprocity, Sangsu Lee, Yang Zhong, Qiaolei Huang, Takashi Enomoto, Shingo Seto, Kenji Araki, Jun Fan, and Chulsoon Hwang

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Analytic Calculation of Jitter Induced by Power and Ground Noise Based on IBIS I/V Curve, Xiuqin Chu, Chulsoon Hwang, Jun Fan, and Yushan Li

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Analytic Passive Intermodulation Behavior on the Coaxial Connector using Monte Carlo Approximation, Xiong Chen, Yongning He, Sen Yang, Wanzhao Cui, Yaojiang Zhang, David Pommerenke, and Jun Fan

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An Efficient High-Speed Channel Modeling Method Based on Optimized Design-of-experiment (DoE) for Artificial Neural Network Training, Heegon Kim, Chunchun Sui, Kevin Cai, Bidyut Sen, and Jun Fan

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An Equivalent Circuit Model to Analyze Passive Intermodulation of Loose Contact Coaxial Connectors, Huiping Yang, He Wen, Yihong Qi, and Jun Fan

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An On-Chip Detector of Transient Stress Events, Abhishek Patnaik, Mihir Suchak, Ramu Seva, Keerthana Pamidimukkala, Greg Edgington, Richard Moseley, James Feddeler, Michael Stockinger, David Pommerenke, and Daryl G. Beetner

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A Transient Event Sensor for Efficient System-Level ESD Testing, Abhishek Patnaik, Shubhankar Marathe, Shun Liu, David Pommerenke, and Daryl G. Beetner

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Bias-Dependent Power Distribution Network Impedance Analysis with MOS Capacitor, DongHyun Kim; Subin Kim; Junyong Park; and For full list of authors, see publisher's website.

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Cable Actuated Dexterous (CADEX) Glove for Effective Rehabilitation of the Hand for Patients with Neurological Diseases, DongHyun Kim and Hyung-Soon Park

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Characterization of ESD Risk for Wearable Devices, Jianchi Zhou, Kaustav Ghosh, Shaojie Xiang, Xin Yan, Ahmad Hosseinbeig, Jongsung Lee, and David Pommerenke

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Characterization of Relative Complex Permittivity and Permeability for Magneto-Dielectric Sheets, Ahmad Hosseinbeig, Shubhankar Marathe, and David Pommerenke

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Characterization of the RFI Rectification Behavior of Instrumentation Amplifiers, Chunyu Wu, Guanghua Li, David Pommerenke, Victor Khilkevich, and Gary Hess

Common-Mode Impedance of a Ferrite Toroid on a Cable Harness, Natalia G. Bondarenko, Marina Koledintseva, Peng Shao, Phil Berger, David Pommerenke, and Daryl G. Beetner

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Coplanar Intermodulation Reference Generator using Substrate Integrated Waveguide with Integrated Artificial Nonlinear Dipole, Xiong Chen, Yongning He, Sen Yang, Anfeng Huang, Yaojiang Zhang, David Pommerenke, and Jun Fan

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DC Ground Compact Wideband Omnidirectional Vertically Polarised Slot Loop Antenna for 4G Long-Term Evolution Applications, Zhanghua Cai, Yihong Qi, Zibin Weng, Wei Yu, Fuhai Li, and Jun Fan

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De-Embedding Comparisons of 1X-Reflect SFD, 1-Port AFR, and 2X-Thru SFD, Yuan Chen, Bichen Chen, Jiayi He, Richard Zai, Jun Fan, and James L. Drewniak

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Dual-Band Directional Slot Antenna for Wi-Fi Application, Yang Xiao, Yihong Qi, Fuhai Li, Jun Fan, Wei Yu, and Liang Lu

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Effect of Different Load Impedances on ESD Generators and ESD Generator SPICE Models, Sen Yang and David Pommerenke

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Effect of Improved Optimization of DFE Equalization on Crosstalk and Jitter in High Speed Links with Multi-Level Signal, Nana Dikhaminjia, J. He, H. Deng, M. Tsiklauri, James L. Drewniak, A. Chada, and B. Mutnury

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Effect of Time Delay Skew on Differential Insertion Loss in Weak and Strong Coupled PCB Traces, David Nozadze, Amendra Koul, Kartheek Nalla, Mike Sapozhnikov, and Victor Khilkevich

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EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly Coupled Three-Phase Resonant Magnetic Field, Chiuk Song; Hongseok Kim; Yongwoo Kim; DongHyun Kim; and For full list of authors, see publisher's website.

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Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel, Sumin Choi; Heegon Kim; Junyong Park; DongHyun Kim; and For full list of authors, see publisher's website.

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Evaluating Characteristics of Electrostatic Discharge (ESD) Events in Wearable Medical Devices: Comparison With the IEC 61000-4-2 Standard, Mehdi Kohani, Aniket Bhandare, Li Guan, David Pommerenke, and Michael G. Pecht

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Evaluating Field Interactions Between Multiple Wires and the Nearby Surface Enabled by a Generalized MTL Approach, Yansheng Wang, Dazhao Liu, Ying S. Cao, Richard W. Kautz, Nevin Altunyurt, Sandeep Chandra, and Jun Fan

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Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel, Junyong Park, DongHyun Kim, Youngwoo Kim, Sumin Choi, and Joungho Kim

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Fast and Precise High-Speed Channel Modeling and Optimization Technique Based on Machine Learning, Heegon Kim, Chunchun Sui, Kevin Cai, Bidyut Sen, and Jun Fan

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High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test, Junyong Park; Hyesoo Kim; Jonghoon J. Kim; DongHyun Kim; and For full list of authors, see publisher's website.

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Impact of Chip and Interposer PDN to Eye Diagram in High Speed Channels, Francesco De Paulis, Biyao Zhao, Stefano Piersanti, Jonghyun Cho, Riccardo Cecchetti, Brice Achkir, Antonio Orlandi, and Jun Fan

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Improved-Sensitivity Resonant Electric-Field Probes Based on Planar Spiral Stripline and Rectangular Plate Structure, Jianwei Wang, Zhaowen Yan, Wei Liu, Xin Yan, and Jun Fan

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Improved Transmitter Jitter Modeling for Accurate Bit Error Rate (BER) Eye Contours using Transient Simulation of Short Bit Patterns, Arun Reddy Chada, Bhyrav Mutnury, Nana Dikhaminjia, Mikheil Tsiklauri, Jun Fan, and James L. Drewniak

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Inductance Models of 8-Terminal Decoupling Capacitors, Tamar Makharashvili, Siqi Bai, Matteo Cecchini, Albert E. Ruehli, Phil Berger, James L. Drewniak, and Daryl G. Beetner

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Machine Learning Based Source Reconstruction for RF Desense, Qiaolei Huang and Jun Fan

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Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils, Kyunghwan Song; Subin Kim; Seungtaek Jeong; DongHyun Kim; and For full list of authors, see publisher's website.

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Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC, Jaemin Lim; Jonghyun Cho; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; DongHyun Kim; and For full list of authors, see publisher's website.

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Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer with On-Chip Low-Dropout (LDO) Regulator, Heegon Kim, Jonghyun Cho, B. Achkir, and Jun Fan

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Modeling of through-Silicon Via (TSV) with an Embedded High-Density Metal-Insulator-Metal (MIM) Capacitor, Kyungjun Cho, Yongwoo Kim, Subin Kim, Gapyeol Park, Kyungjune Son, Hyunwook Park, Seongguk Kim, Sumin Choi, DongHyun Kim, and Jongho Kim

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MoM-Based Ground Current Reconstruction in RFI Application, Qiaolei Huang, Liang Li, Xin Yan, Bumhee Bae, Harkbyeong Park, Chulsoon Hwang, and Jun Fan

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Noncontact Wideband Current Probes with High Sensitivity and Spatial Resolution for Noise Location on PCB, Zhaowen Yan, Wei Liu, Jianwei Wang, Donglin Su, Xin Yan, and Jun Fan

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Objective MIMO Measurement, Jun Li, Yihong Qi, Wei Yu, Fuhai Li, Jun Fan, Antonio Orlandi, Zhiping Yang, and Songping Wu