EMI Investigation and Mitigation of Flexible Flat Cables and Connectors
Abstract
In modern mobile devices, as a result of the increase in data rate, requirement for higher density signal and cost-effective solution, the flexible flat cable (FFC) now plays an important role to connect separated printed circuit boards (PCBs). Due to the low-cost fabrication and varied shielding structure, FFC has been identified as a noise source for electromagnetic interference (EMI) and desense issues. In this paper, the common mode noise generated from FFC and related connectors is investigated. With the assistance of full wave and circuit simulation, main cause of the common mode noise has been identified as the ground discontinuity and the related voltage difference between the PCB ground and the FFC ground. By providing better shielding and improving ground continuity, 11 dB reduction of total radiation power (TRP) is observed at 5 GHz.
Recommended Citation
X. Yan et al., "EMI Investigation and Mitigation of Flexible Flat Cables and Connectors," Proceedings of the 2021 Joint IEEE International Symposium on EMC/SI/PI, and EMC Europe (2021, Raleigh, NC), pp. 515 - 519, Institute of Electrical and Electronics Engineers (IEEE), Aug 2021.
The definitive version is available at https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559277
Meeting Name
2021 IEEE International Joint Electromagnetic Compatibility Signal and Power Integrity and EMC Europe Symposium, EMC/SI/PI/EMC Europe 2021 (2021: Jul. 26-Aug. 13, Raleigh, NC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Flexible Flat Cable; Ground Discontinuity; Noise
International Standard Book Number (ISBN)
978-166544888-8
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2021 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
13 Aug 2021
Comments
This work was supported in part by the National Science Foundation (NSF) under Grant IIP-1916535.