Dielectric Constant Extraction for Microstrip Transmission Lines based on S-Parameter Measurements and Cross-Section
Abstract
In this paper, a new dielectric constant extraction method for the microstrip substrate material is proposed, which is based on measured S-parameter and cross-section analysis of the transmission lines. The calculation process is detailed and application examples are given. The phase constant is calculated from the measured S-parameters. By analyzing the cross-section geometry using a 2D solver, the per-unit-length inductance and capacitance of the air-filled line are obtained. Then using analytical expressions, the dielectric constant of the substrate is extracted from the effective dielectric constant. Comparing to the published method that requires knowing the characteristic impedance of the line, the new method will introduce less error to the extraction procedure and will provide more accurate results.
Recommended Citation
Y. Liu et al., "Dielectric Constant Extraction for Microstrip Transmission Lines based on S-Parameter Measurements and Cross-Section," Proceedings of the 2021 Joint IEEE International Symposium on EMC/SI/PI, and EMC Europe (2021, Raleigh, NC), pp. 982 - 987, Institute of Electrical and Electronics Engineers (IEEE), Aug 2021.
The definitive version is available at https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559371
Meeting Name
2021 IEEE International Joint Electromagnetic Compatibility Signal and Power Integrity and EMC Europe Symposium, EMC/SI/PI/EMC Europe 2021 (2021: Jul. 26-Aug. 13, Raleigh, NC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Dielectric Constant Extraction; Microstrip; Printed Circuit Board; S-Parameter; Transmission Line
International Standard Book Number (ISBN)
978-166544888-8
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2021 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
13 Aug 2021