Modeling Multilayer Power Distribution Network by Systematically Incorporating Via and Cavity Models
Abstract
A closed-form expression for via barrel-plate capacitances is derived. This results in a more accurate equivalent circuit model for decoupling capacitors including both parasitic inductances and via capacitances. Multilayer power distribution network (PDN) is then analyzed by incorporating the circuit models of both vias and parallel plane pair. Circuit simulator is used to evaluate the coupling properties among various locations in the multilayer PDN structures.
Recommended Citation
Y. Zhang et al., "Modeling Multilayer Power Distribution Network by Systematically Incorporating Via and Cavity Models," 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp. 335 - 338, article no. 4559880, Institute of Electrical and Electronics Engineers, Sep 2008.
The definitive version is available at https://doi.org/10.1109/APEMC.2008.4559880
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-981080628-6
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
19 Sep 2008
